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    Critical temperatures in thermocompression gold stud bonding by Zhang, G. G., Ang, X. F., Chen, Z., Wong, Chee C., Wei, J.

    Published 2012
    “…Under similar bonding conditions, the critical temperature is lower for a harder substrate than for a softer substrate, primarily because of larger interfacial shear stresses. This is supported by the observation on the interfacial shear stress distribution at the bonding interface based on finite element simulation models of substrates with different hardness.…”
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    Journal Article
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