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701
Cold forging die design assisted by finite element simulation
Published 2008“…In this study, a copper heat sink, which is an electronic component with heat sinking function, is identified as a sample to verify the effectiveness of finite element simulation.…”
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Thesis -
702
Deep learning for object detection and image segmentation
Published 2020“…The aim of this project is to develop an automated solution to allow the robot to pick up the indicated object accurately from a clustered bin in bin-picking. …”
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Final Year Project (FYP) -
703
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704
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705
Fabrication of paper-based electrode using NiCo2O4 for solid-state supercapacitor
Published 2018“…The flexible electrode was first fabricated by the vacuum filtration of a suspension containing carbon nanofibers and Chinese ink. The conductive paper allowed the further electrodeposition of NiCo2O4 to improve its capacitance. …”
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Final Year Project (FYP) -
706
Traffic speed characteristics around road humps in Nanyang Technological University
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Final Year Project (FYP) -
707
Experimental investigation on working of PCR chip
Published 2014“…Experiments were carried out both with the ink only, and also with ink, sealed with oil. The purpose of oil to prevent evaporation was also studied in detail. …”
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Final Year Project (FYP) -
708
An achievable region for double-unicast networks with linear network coding
Published 2014“…In this paper, we present an achievable rate region for double-unicast networks by assuming that the intermediate nodes perform random linear network coding, and the source and sink nodes optimize their strategies to maximize the achievable region. …”
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Journal Article -
709
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710
Ultrsonic testing of bond integrity in adhesive joints between 2 similar metals
Published 2017“…In the presence of a cohesive bond at the adhesive-adherend interface, the A-scan is able to pick up the adhesive signals during ultrasonic testing. …”
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Final Year Project (FYP) -
711
Design of wideband low-loss reconfigurable reflectarray antenna
Published 2024“…It proposes an RRA design that integrates a PIN diode with air gap. The switch of the reconfigurable unit is directly mounted on the reflective element, reducing the loss introduced by the switching device. …”
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Thesis-Master by Coursework -
712
Development of optical transceiver
Published 2010“…For PIN photodiodes, the epitaxial layer was introduced to the structures to act as an intrinsic layer. …”
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Final Year Project (FYP) -
713
Functional development and experiments of a specific robotic arm based on ROS
Published 2022“…If the target is in the range of robotic arm, it will start to pick and place it to the designated location. (4) By using the multi-machine communication mechanism of ROS, the same two robotic arms could complete sync mirroring work. …”
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Thesis-Master by Coursework -
714
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715
Single-phase convective heat transfer in a cold plate with wavy channels
Published 2020“…The microchannel heat sink provides superior heat transfer capabilities and it had been studied for a few decades to even further enhance the heat transfer. …”
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Final Year Project (FYP) -
716
女性媒介形象建构与话语权赋权 ——《脱口秀大会》系列为例 = Female discourse power and construction of female image —— Rock&Roast stand-up comedy series...
Published 2022“…Traditional forms Chinese comedy, represented by comic strips (xiao pin) and sketches (xiang sheng), has been produced by and for the gaze of male, both in terms of its historical development and the content. …”
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Final Year Project (FYP) -
717
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718
Design and simulation of silicon optoelectronic integrated circuits
Published 2009“…A main component of the blu-ray disc system, the optical pick-up unit (OPU), requires a PDIC (photodetector integrated circuit) consisting of photodetector and preamplifier. …”
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Final Year Project (FYP) -
719
Development of a compact PCB cooling system comprising a flexible bellow and a closed two phase thermosyphon
Published 2008“…The report documents the development of a flexible bellow heat sink with finned thermosyphons. The main objective of this project was to demonstrate the working principle of the thermosyphon with flexible bellow in electronic cooling. …”
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Thesis -
720
Remarkably enhanced thermal transport based on a flexible horizontally-aligned carbon nanotube array film
Published 2018“…The primary reason is the large thermal contact resistance between the CNT tips and the heat sink. Here we report a simultaneous sevenfold increase in in-plane thermal conductivity and a fourfold reduction in the thermal contact resistance at the flexible CNT-SiO2 coated heat sink interface by coupling the CNTs with orderly physical overlapping along the horizontal direction through an engineering approach (shear pressing). …”
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Journal Article