Chromatin interaction neural network (ChINN) : a machine learning-based method for predicting chromatin interactions from DNA sequences by Cao, Fan, Zhang, Yu, Cai, Yichao, Animesh, Sambhavi, Zhang, Ying, Akincilar, Semih Can, Loh, Yan Ping, Li, Xinya, Chng, Wee Joo, Tergaonkar, Vinay, Kwoh, Chee Keong, Fullwood, Melissa Jane

“…We apply ChINN to 6 chronic lymphocytic leukemia (CLL) patient samples and a published cohort of 84 CLL open chromatin samples. …”
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Effects of doping concentration on bond length and bond energy studied by Raman shift by Yang, Xuexian, Dong, Zhili, Sun, Chang Q.

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Crystal Engineering of a Two-Dimensional Lead-Free Perovskite with Functional Organic Cations by Second-Sphere Coordination by Cortecchia, Daniele, Soci, Cesare, Cametti, Massimo, Petrozza, Annamaria, Martí-Rujas, Javier

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Design analysis of adhesively bonded structures by Wong, Ee-Hua, Liu, Johan

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Bond strength of 3D printed concrete by Panda, Biranchi, Tay, Daniel Yi Wei, Ting, Andrew Guan Heng, He, Lewei, Tan, Ming Jen

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Critical temperatures in thermocompression gold stud bonding by Zhang, G. G., Ang, X. F., Chen, Z., Wong, Chee C., Wei, J.

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Effect of hydrogen bond interaction on protein phase transition by Leong, Hon Wai, Chew, Lock Yue

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C-F bond activation by transient phosphenium dications by Đorđević, Nemanja, Tay, Madelyn Qin Yi, Muthaiah, Senthilkumar, Ganguly, Rakesh, Dimić, Dušan, Vidović, Dragoslav

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Peptide asparaginyl ligases—renegade peptide bond makers by Tam, James P., Chan, Ning-Yu, Liew, Heng Tai, Tan, Shaun J., Chen, Yu

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Ammonium and caesium carbonate peroxosolvates: supramolecular networks formed by hydrogen bonds by Medvedev, Alexander G., Mikhaylov, Alexey A., Churakov, Andrei V., Prikhodchenko, Petr V., Lev, Ovadia

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Oxidation of a P-C Bond under Mild Conditions by Ilić, Gordana, Gaguly, Rakesh, Petković, Milena, Vidović, Dragoslav

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Recent development in halogen-bonding-catalyzed living radical polymerization by Wang, Chen-Gang, Chong, Amerlyn Ming Liing, Pan, Matthew Houwen, Sarkar, Jit, Tay, Xiu Ting, Goto, Atsushi

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Debonding of bonded composite joints with TEP modified epoxy adhesives by Caglar, Hasan, Sridhar, Idapalapati, Sharma, Mohit, Chian, Kerm Sin

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Rapid defect detections of bonded wafer using near infrared polariscope by Asundi, Anand Krishna, Ng, Chi Seng

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Analysis and design recommendations for structures strengthened by prestressed bonded Fe-SMA by Li, Lingzhen, Wang, Sizhe, Chatzi, Eleni, Motavalli, Masoud, Ghafoori, Elyas

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Hydrogen-bond memory and water-skin supersolidity resolving the Mpemba paradox by Zhang, Xi, Huang, Yongli, Ma, Zengsheng, Zhou, Yichun, Zhou, Ji, Zheng, Weitao, Jiang, Qing, Sun, Changqing

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Molecular dynamics and simulations study on the vibrational and electronic solvatochromism of benzophenone by Kumar, Venkatraman Ravi, Verma, Chandra, Umapathy, Siva

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Thermal shock resistance enhancement by improved interfacial bonding for carbon/aluminium composites by Wei, Wenfu, Huang, Zhanglin, Yin, Guofeng, Yang, Zefeng, Li, Xiaobo, Zuo, Haozi, Deng, Qin, Huang, Guizao, Ren, Junwen, Liao, Qianhua, Yang, Yan, Wu, Guangning

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Understanding the bonding mechanisms of directly sputtered copper thin film on an alumina substrate by Lim, Ju Dy, Lee, Pui Mun, Chen, Zhong

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Hydrogen bond and surface stress relaxation by aldehydic and formic acidic molecular solvation by Chen, Jiasheng, Yao, Chuang, Zhang, Xi, Sun, Chang Q., Huang, Yongli

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