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    Effect of polyvinylpyrrolidone additive in the substrate of thin-film composite forward osmosis polyvinylidene fluoride membrane on neodymium rejection by Yeoh, Yuan Xin, Mazrul Nizam, Abu Seman, Mohd Yusri, Mohd Yunus, Abdul Wahab, Mohammad, Nurul Ain, Ismail

    Published 2025
    “…Then, the non-solvent induced phase separation (NIPS) method was used to cast the substrate and the interfacial polymerization (IP) process was applied to form a polyamide (PA) thin-film active layer on the top surface. All TFC membranes except pristine PVDF membranes were able to reject neodymium higher than 94 %. …”
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    Article
  8. 248

    An experimental study of lateral charge transfer in silicon nanocrystal layer embedded in SiO2 thin film by Wong, J. I., Chen, T. P., Tay, Y. Y., Liu, P., Yang, M., Liu, Z., Yang, H. Y.

    Published 2015
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films…”
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    Journal Article
  9. 249

    Carbon-based thin-film actuator with 1D to 2D transitional structure applied in smart clothing by Jing, Yangmin, Shi, Qiuwei, Hou, Chengyi, Zhang, Qinghong, Li, Yaogang, Wang, Hongzhi

    Published 2021
    “…Searching for the way to improve strength, sensitivity and controllability is one of the directions of efforts of actuators to meet the growing demands in smart electronics and smart clothing. Herein, a kind of thin-film actuator with transitional carbon structure is developed by ordered filtration of carbon nanotubes and graphene oxide. …”
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    Journal Article
  10. 250

    Deposition and characterisation of carbon thin films via patented Off-Plane Double Bend FCVA deposition system by Lee, Jin Zhou

    Published 2022
    “…In this project, carbon thin films that are deposited by Off-Plane Double Bend (OPDB) Filtered Cathodic Vacuum Arc (FCVA) system are characterised. …”
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    Final Year Project (FYP)
  11. 251

    Enantiomeric separation of racemic mixtures using chiral-selective and organic-solvent-resistant thin-film composite membranes by Ong, Chi Siang, Oor, Jia Zheng, Tan, Jonathan Shiliang, Chew, Jia Wei

    Published 2022
    “…In this study, we fabricated a novel thin-film composite nanofiltration membrane composed of (2-hydroxypropyl)-beta-cyclodextrin (HP-β-CD) as the chiral selector for the enantiomeric separation of racemic 1-phenylethanol chiral compounds in organic solvents. …”
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    Journal Article
  12. 252

    Ferroelectric Lead Zirconate Titanate (PZT) thin films by metallo-organic decomposition (MOD) technology for memory applications by Liu, Zhi Qing.

    Published 2009
    “…Ferroelectric thin film materials have had a strong resurgence and development in recent years, primarily because of their attractive properties of their high dielectric constant and reversible, large remnant polarization for non-volatile random access memory (NV-RAM) and dynamic random access memory (DRAM) applications.…”
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    Thesis
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    Barrier properties of thin Au/Ni–P under bump metallization for Sn–3.5Ag solder by Kumar, Aditya, He, Min, Chen, Zhong

    Published 2013
    “…Electroless Ni–P with a thin layer of immersion gold has been considered as a promising under bump metallization (UBM) for low-cost flip–chip technology. …”
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    Journal Article
  17. 257

    Effects of rapid thermal annealing on structural, magnetic and optical properties of Ni-doped ZnO thin films by Zhao, Xing, Liu, Erjia, Ramanujan, Raju Vijayaraghavan, Chen, Jingsheng

    Published 2013
    Subjects: “…DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films…”
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    Journal Article
  18. 258

    Flexible write-once–read-many-times memory device based on a nickel oxide thin film by Yu, Q., Liu, Y., Liu, Z., Yu, Y. F., Lei, H. W., Zhu, J., Chen, Tupei, Fung, Stevenson Hon Yuen

    Published 2013
    “…A write-once-read-many-times (WORM) memory device based on conduction switching of a NiO thin film in a metal-insulator-metal structure is fabricated on a flexible substrate. …”
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    Journal Article
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    Optimizing selenization conditions of Cu2CdSn(S,Se)4 by Wong, Jia Mian

    Published 2022
    Subjects: “…Engineering::Materials::Microelectronics and semiconductor materials::Thin films…”
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    Final Year Project (FYP)