Anisotropic conductive adhesive for micro joining in semiconductor interconnects application (solder alternative for fine pitch & environment friendly IC packaging) by Goh, Chin Foo

“…Therefore, the main objectives of this project are to develop nanosized hollow silica microspheres and encapsulate nickel with these microspheres. …”
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Outlook for the dry bulk shipping market in the next 5 years by Sam, Dave Perry, Chang, Yvonne, Yeo, Kai Hong

“…The severity of the impacts will also be looked into. Oversupply is the main reason for the decline in the dry bulk market. …”
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Society 5.0 : First International Conference, Society 5.0 2021, Virtual Event, June 22-24, 2021 : Revised Selected Papers / by International Conference on Society 5.0 (1st : 2021 : Online), organiser 642899, Gerber, Aurona J., editor 642901, Hinkelmann, Knut, editor 642902

“…This book constitutes revised and selected papers from the First International Conference on Society 5.0, Society 5.0 2021, held virtually in June 2021. …”

S-band Five-port ring reflectometer for synthetic breast tissues dielectric determination / by Lee, Chia Yew, 1988-, author 615259, Tan, Tian Swee, supervisor 637707, You, Kok Yeow, supervisor 501327, Fakulti Biosains dan Kejuruteraan Perubatan

S-band Five-port ring reflectometer for synthetic breast tissues dielectric determination / by Lee, Chia Yew, 1988-, author 615259

SnapAssist v4 apps - audio/vibrate related by Tan, Nicholas Zi Yong

“…The focus of the project is mainly on creating new Sound based hardware…”
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Abdullah Ahmad Badawi : perjalanan politik PM ke-5 / by Chamil Wariya, 1952-

Grid array antenna for 5G mobile communications systems / by Muhammad Sani Yahya, 1984-, author 641505, Sharul Kamal Abdul Rahim, supervisor 548100, Fakulti Kejuruteraan Elektrik 540663

Subjects: “…5G mobile communication systems…”

Novel Millimetre Wave Antennas for MIMO and 5G Applications / by Koul, Shiban K., author 448980, Wani, Zamir, author 643132

Subjects:

UMPSA is 5th best in the world for SDG #1 No Poverty by Mimi Rabita, Abd Wahit

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LightStick V2 (ESP-01+Android app) by Tham, Wai Hong

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SCSE FYP and MSCS IA system development part 5 by Ong, Celestine Xin Rui

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Circularly polarized antennas and phased arrays for 5G applications by Hu, Yiyun

“…The scanning array has a maximum gain of 15.6 dBi, with a gain drop of no more than 2.5 dB over the scanning range. Circularly polarized radiation characteristics could be realized at all target directions.…”
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The 5th International Yi-Burmese Conference: a description by Fu, Allan, Wu, Zhu

“…The Fifth International Yi-Burmese Conference (IYBC) was held August 1-5, 1991, in Xichang, capital of the Liangshan Yi Autonomous Prefecture. …”
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RF front end for 5.8GHz wireless LAN by Zhang, Ling

“…This project is to study and set up the transceiver RF front end for 5.8GHz U-NII band. This project will be limited to the search and selection of the suitable parts, setting up of the transceiver architecture, and evaluating the transceiver link performance using the Agilent Technology ADS simulators.…”
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Theoretical model for the I-V characteristics of the flash EEPROM cell by Chong, Wei Tao.

“…Hence, an accurate simulation for the device current voltage (I-V) and other characteristics is important. With an accurate physical model, the parameters can be varied to give a better prediction of the current drive, threshold voltage etc. …”
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Growth and optimization of III-V semiconductor solar cell structures. by Lim, Kuo Hou.

“…It is found that a MBE grown 1×1cm2 solar cells under 1 sun illumination at AM1.5 G is able to achieve maximum conversion efficiency closed to 16% with MgF2/ZnS double layers anti reflective coating. …”
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Heteroepitaxial growth and characterization of lll-V compound semiconductor on silicon by Hendrix Tanoto

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Fixtured vibratory finishing of Ti-6Al-4V by Houmayune, Haja Abdul Jaafer.

“…The Ti 6AL-4V alloy accounts for almost 50% of all alloys used in aircraft applications due to its favourable properties. …”
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Design of 1.8V supply subthreshold voltage reference by Wang, Xiaoying

“…Nonetheless, the process used in this design is Austria Micro System 0.18μm CMOS with 1.8V supply. Hence the headroom of device operation is limited due to low supply voltage. …”
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