Showing 541 - 560 results of 4,110 for search '((pinkae OR (((anda OR line) OR ming) OR pined)) OR (pink OR long))', query time: 0.18s Refine Results
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    3D simulation-based research on the effect of interconnect structures on circuit reliability by He, Feifei, Tan, Cher Ming

    Published 2015
    “…The simulation of the EM reliability of the interconnects is usually performed using the line-via structure at the EM test temperature (e.g. 300 oC).However, such simulation using the line-via structure may not give the same void nucleation location as in the real circuit structure, especially at the circuit operation temperature (e.g. 90C). …”
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    Journal Article
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    A Japan with Fewer Japanese: Enter the Machines by Tan, Ming Hui, Lim, Christopher H.

    Published 2017
    “…Japan has long been beset by persisting demographic challenges – an ageing population, a shrinking workforce, and a reluctance to embrace immigration. …”
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    Commentary
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    Bioinspired mechanically interlocking structures by Zhu, Ming, Zhang, Feilong, Chen, Xiaodong

    Published 2021
    “…Mechanically interlocking structures at various interfaces in nature have been observed for a long time, and their underlying interacting mechanisms have been deeply investigated. …”
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    Journal Article
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