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    Effect of prebonding anneal on the microstructure evolution and Cu–Cu diffusion bonding quality for three-dimensional integration by Peng, L., Zhang, L., Li, H.Y., Lim, Dau Fatt, Tan, Chuan Seng

    Published 2013
    “…Our work has identified a Cu–Cu bonding process with a lower total thermal budget, which is seen as a favorable option for future three-dimensional (3D) integrated circuit (IC) technology.…”
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    Journal Article
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