Novel integrated circuit pressed ceramic package antenna by Xue, Yang

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Synthesis of fiber gratings using genetic algorithm by Zhao, Ning.

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Implementation of voice over Internet Protocol using session initialization protocol by Chua, Eng Huat.

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Study of connection re-routing schemes for ATM-based wireless networks by Muhammad Arshad Kashif.

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Evaluation of WAP access methods on mobile phones by Zhang, Hua

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Cyber-physical thermal management of 3D multi-core cache-processor system with microfluidic cooling by Qian, Hanhua, Huang, Xiwei, Yu, Hao, Chang, Chip Hong

“…Our work analyzes and predicts the fine-grained temperature profile of multi-core processorcache system. …”
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Effect of solution treatment on high tempreature oxidation of Fe-33Ni-19Cr alloys Fe-40Ni-24Cr alloys. by Parimin, Noraziana

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Scene understanding based on heterogeneous data fusion by Zhu, Lingzhi

“…This network achieves 0.77 mean average precision without any fine tuning. Moreover, after fine tuning process, the highest mAP score it can reach is 0.804. …”
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Optimizing selenization conditions of Cu2CdSn(S,Se)4 by Wong, Jia Mian

“…Previous research has shown that varying heating rate and annealing time can reduce the fine grain layer, improving device’s overall efficiency. …”
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Numerical modeling of motion and deformation of cells in microscale hydrodynamic and electric fields by Ye, Ting

“…For 3D problems however, the MPBLS method becomes tedious as usual, since the Lagrangian particles in 3D domain are not easily used to describe the information of surface-like interface. • The modified SIMPLER algorithm introduces an improved velocity correction to speed up the convergence of momentum equations, and further integrates a fine adjustment to satisfy the continuity equation with higher accuracy. …”
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Quantitative evaluation of stone fragments in extracorporeal shock wave lithotripsy using a time reversal operator by Wang, Jen-Chieh, Zhou, Yufeng

“…Extracorporeal shock wave lithotripsy (ESWL) has been used widely in the noninvasive treatment of kidney calculi. The fine fragments less than 2 mm in size can be discharged by urination, which determines the success of ESWL. …”
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Strength improvement by surcharge and vacuum preloading by Lew, Chloe Yan Bin Jmi

“…This study used Kaolin as the sample material to examine the impact of vacuum and surcharge preloading on the undrained shear strength and soil-water characteristic curve of fine-grained soil. Consolidated kaolin samples were trimmed into cylindrical specimens and subjected to different pre-consolidation pressures. …”
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Bi-factorial preference optimization: balancing safety-helpfulness in language models by Zhang, W, Torr, PHS, Elhoseiny, M, Bibi, A

“…Fine-tuning large language models (LLMs) on human preferences, typically through reinforcement learning from human feedback (RLHF), has proven successful in enhancing their capabilities. …”

Efficient algorithms for multicast routing by Aw, Claudment Ah Lam

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Design of an eco-friendly vegetable/flower bed for the HDB balcony by Chang, Cheng Hung.

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Development of a test bed to investigate conducted and radiated emissions from power line communication networks by Thin, Virainia.

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Implementation of wireless sensor network in a smart home system by Qiu, Haojie

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A physical model for sloping capillary barriers by Rahardjo, Harianto, Tami, Denny, Leong, Eng Choon, Fredlund, Delwyn G.

“…A sloping two-layer capillary barrier model consisting of a relatively fine soil layer over a relatively coarse soil layer was constructed inside a specially designed apparatus. …”
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Anomaly detection in aerosol jet printing via computer vision & machine learning by Ang, Ryan Wei Hao

“…The Aerosol Jet Printing (AJP) technique is a relatively new contactless direct write method that is being developed for the purpose of producing fine features on a diverse selection of surfaces. …”
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Flip chip joint-in-via architecture on flexible substrates with Au-Sn interdiffusion bonding by Lee, Teck Kheng

“…Field applications using existing packaging infrastructure has demonstrated the robustness of applying the SLICF bonding with the joint-in-via architecture for fine pitch flip-chip applications.…”
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