Showing 761 - 780 results of 3,194 for search '((pinnae OR (fine OR (pinaed OR pined))) OR (pinn OR long))', query time: 0.13s Refine Results
  1. 761

    Under the Roof by Cheah, Sue Lyn

    Published 2023
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    Final Year Project (FYP)
  2. 762

    Covert by Chia, Celeste Yi Ying

    Published 2023
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    Final Year Project (FYP)
  3. 763

    Filament winding of thermoplastic composite pipes for engineering applications by Lim, Samuel

    Published 2023
    “…The aim of this study was to optimize the fabrication process of filament winding of thermoplastic composite pipes through fine-tuning parameters and explore how different fabrication process parameters can potentially affect its final properties. …”
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    Final Year Project (FYP)
  4. 764

    Hierarchical feature attention with bottleneck attention modules for multi-branch classification by Gan, Ryan

    Published 2024
    “…While existing attention mechanisms often focus on pre-processing images, fine-grained classification tasks benefit from leveraging hierarchical relationships within categories. …”
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    Final Year Project (FYP)
  5. 765

    Drawing memories. by Chang, Jerly Wei Kiang.

    Published 2010
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    Final Year Project (FYP)
  6. 766

    XYZ translation by Au, Chong Weng

    Published 2010
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    Final Year Project (FYP)
  7. 767

    The Scene. by Lim, Rachel Shi Ean.

    Published 2010
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    Final Year Project (FYP)
  8. 768

    Design and development of a micromachined vibratory gyroscope with enhanced mechanical sensitivity by Leow, Kok Wah.

    Published 2011
    “…Most of the current research activities in micromachined gyroscope are focusing on the design of a single resonator to increase mechanical sensitivity and performance. These aim to fine tuning the design factors that directly affect the vibration characteristic of the resonator in order to improve the sensitivity. …”
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    Thesis
  9. 769
  10. 770
  11. 771
  12. 772

    Parachute kids by Wah, Hubert Yun Teng

    Published 2013
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    Final Year Project (FYP)
  13. 773

    Coda. by Zurianah Hashim.

    Published 2013
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    Final Year Project (FYP)
  14. 774
  15. 775
  16. 776

    Development of indexing clamper mechanism for wire bonder by Zhang, Yue.

    Published 2008
    “…For wire bonding integrated circuits, the state-of-art is 30 u.m fine pitch, and the position accuracy of material transmission for wire bonder is required to be 3.5 urn or less. …”
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    Thesis
  17. 777
  18. 778
  19. 779
  20. 780

    Package and board level reliability modeling of advanced CSP pakages for telecommunication applications by Tee, Tong Yan

    Published 2008
    “…These technology requirements are possible with the recent development of advanced Chip Scale Packages (CSPs), such as thin-profile fine-pitch Ball Grid Array (TFBGA), Quad-Flat-No-lead (QFN), and wafer-level CSP (WL-CSP). …”
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    Thesis