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pinnae » pinna (Expand Search), pinnau (Expand Search), pinnacle (Expand Search), pingae (Expand Search), pinae (Expand Search), pinaae (Expand Search)
fine » find (Expand Search), line (Expand Search), five (Expand Search)
pinaed » pinned (Expand Search), pinard (Expand Search)
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pinn » ping (Expand Search), pin (Expand Search), pina (Expand Search)
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Filament winding of thermoplastic composite pipes for engineering applications
Published 2023“…The aim of this study was to optimize the fabrication process of filament winding of thermoplastic composite pipes through fine-tuning parameters and explore how different fabrication process parameters can potentially affect its final properties. …”
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Final Year Project (FYP) -
764
Hierarchical feature attention with bottleneck attention modules for multi-branch classification
Published 2024“…While existing attention mechanisms often focus on pre-processing images, fine-grained classification tasks benefit from leveraging hierarchical relationships within categories. …”
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Final Year Project (FYP) -
765
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766
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767
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768
Design and development of a micromachined vibratory gyroscope with enhanced mechanical sensitivity
Published 2011“…Most of the current research activities in micromachined gyroscope are focusing on the design of a single resonator to increase mechanical sensitivity and performance. These aim to fine tuning the design factors that directly affect the vibration characteristic of the resonator in order to improve the sensitivity. …”
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Thesis -
769
Tales of the Chugawagas : from conception to production.
Published 2011Get full text
Final Year Project (FYP) -
770
Ideal houses : a visual research case study on factors that define a house.
Published 2011Get full text
Final Year Project (FYP) -
771
Look on the bright sight : an illustration project inspired by three visually-impaired photographers.
Published 2011Get full text
Final Year Project (FYP) -
772
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773
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774
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775
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776
Development of indexing clamper mechanism for wire bonder
Published 2008“…For wire bonding integrated circuits, the state-of-art is 30 u.m fine pitch, and the position accuracy of material transmission for wire bonder is required to be 3.5 urn or less. …”
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Thesis -
777
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778
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779
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780
Package and board level reliability modeling of advanced CSP pakages for telecommunication applications
Published 2008“…These technology requirements are possible with the recent development of advanced Chip Scale Packages (CSPs), such as thin-profile fine-pitch Ball Grid Array (TFBGA), Quad-Flat-No-lead (QFN), and wafer-level CSP (WL-CSP). …”
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Thesis