Showing 381 - 400 results of 2,568 for search '((pinnae OR (line OR (spinggge OR swinggge))) OR ((sping OR (aina OR nina)) OR (ming OR peng)))', query time: 0.19s Refine Results
  1. 381
  2. 382
  3. 383
  4. 384
  5. 385
  6. 386

    3D simulation-based research on the effect of interconnect structures on circuit reliability by He, Feifei, Tan, Cher Ming

    Published 2015
    “…The simulation of the EM reliability of the interconnects is usually performed using the line-via structure at the EM test temperature (e.g. 300 oC).However, such simulation using the line-via structure may not give the same void nucleation location as in the real circuit structure, especially at the circuit operation temperature (e.g. 90C). …”
    Get full text
    Get full text
    Get full text
    Journal Article
  7. 387
  8. 388
  9. 389
  10. 390
  11. 391
  12. 392
  13. 393
  14. 394
  15. 395
  16. 396
  17. 397

    On the edge‐toughness of a graph. II by Peng, Y.H., Tay, T.S.

    Published 1993
    “…We also give a simpler proof to the following result of Peng et al.: For any positive integers r, s satisfying r/2 < s ≤ r, there exists an infinite family of graphs such that for each graph G in the family, λ(G) = r (where λ(G) is the edge‐connectivity of G) T1(G) = s, and G can be factored into s spanning trees.…”
    Article
  18. 398
  19. 399
  20. 400