Search alternatives:
pinnae » pinna (Expand Search), pinnau (Expand Search), pinnacle (Expand Search), pingnae (Expand Search), spinnae (Expand Search)
line » like (Expand Search), life (Expand Search)
shing » ching (Expand Search), sheng (Expand Search), shin (Expand Search)
ming » min (Expand Search), ling (Expand Search)
sping » spin (Expand Search), swing (Expand Search), spine (Expand Search), spingg (Expand Search), ssping (Expand Search)
pengat » penguat (Expand Search), pingat (Expand Search), pangat (Expand Search)
pin » ping (Expand Search), spin (Expand Search)
pinnae » pinna (Expand Search), pinnau (Expand Search), pinnacle (Expand Search), pingnae (Expand Search), spinnae (Expand Search)
line » like (Expand Search), life (Expand Search)
shing » ching (Expand Search), sheng (Expand Search), shin (Expand Search)
ming » min (Expand Search), ling (Expand Search)
sping » spin (Expand Search), swing (Expand Search), spine (Expand Search), spingg (Expand Search), ssping (Expand Search)
pengat » penguat (Expand Search), pingat (Expand Search), pangat (Expand Search)
pin » ping (Expand Search), spin (Expand Search)
-
361
Ce yin zhi xin in the Mencius : being concerned for the other
Published 2019Get full text
Final Year Project (FYP) -
362
Investigating accuracy of contour interpolation in modal and amodal completion
Published 2019Get full text
Final Year Project (FYP) -
363
Scratch based graphical programming online guide/exam system
Published 2019Get full text
Final Year Project (FYP) -
364
Degradation of plastic waste due to wave action
Published 2019Get full text
Final Year Project (FYP) -
365
Keyword and named entity recognition on air traffic control (ATC) data
Published 2019Get full text
Final Year Project (FYP) -
366
-
367
-
368
Study on ultra-precision compliant mechanisms for nanotechnology applications
Published 2008Get full text
Research Report -
369
-
370
3D simulation-based research on the effect of interconnect structures on circuit reliability
Published 2015“…The simulation of the EM reliability of the interconnects is usually performed using the line-via structure at the EM test temperature (e.g. 300 oC).However, such simulation using the line-via structure may not give the same void nucleation location as in the real circuit structure, especially at the circuit operation temperature (e.g. 90C). …”
Get full text
Get full text
Get full text
Journal Article -
371
Patterned surface with controllable wettability for inkjet printing of flexible printed electronics
Published 2014Get full text
Get full text
Journal Article -
372
Metasurface-tunable lasing polarizations in a microcavity
Published 2023Get full text
Journal Article -
373
Understanding organic solvent permeation during nanofiltration via electrical impedance spectroscopy (EIS)
Published 2024Get full text
Journal Article -
374
Lancing drug reservoirs into subcutaneous fat to combat obesity and associated metabolic diseases
Published 2021Get full text
Journal Article -
375
-
376
Potential utilisation of solar-assisted kiln dryer in bamboo drying
Published 2024Get full text
Article -
377
Health and disease phenotyping in old age using a cluster network analysis
Published 2018Get full text
Get full text
Journal Article -
378
-
379
-
380