Showing 141 - 160 results of 434 for search '((pinnae OR qingge) OR (((spie OR (sink OR pick)) OR sspinna) OR pin))', query time: 0.15s Refine Results
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    Enhanced microscale heat transfer phenomena in macro geometry by Lembono, Teguh Santoso.

    Published 2012
    “…The high heat removal capability of microchannel heat sink meets the demand of high heat dissipation from various applications, especially in the microprocessor industry. …”
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    Final Year Project (FYP)
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  14. 154

    Convective boiling and condensation in enhanced tubes produced by selective laser melting by Tan, Choon Yong

    Published 2018
    “…The design of the four tubes are five long circumferential pin fins, eight short circumferential pin fins, twisted pin fins and a metallic foam structure. …”
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    Final Year Project (FYP)
  15. 155

    Using edge detection and polarimetric imaging for vaccine inspection by Sharan, Praveer, Tellbach, Denise, Sarma, Sanjay E.

    Published 2024
    “…SPIE Smart Structures + Nondestructive Evaluation, 2022, Long Beach, California, United States…”
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    Article
  16. 156

    A two-dimensional co-rotational Timoshenko beam element with XFEM formulation by Xu, Jin, Lee, Chi King, Tan, Kang Hai

    Published 2014
    “…Pin connections and plastic hinges produce non-smooth displacement fields in beam structures. …”
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    Journal Article
  17. 157

    Design of a mechatronic system using Arduino Uno by Chong, Kok Leong

    Published 2023
    “…Therefore, this Final Year Project (FYP) aims to create a Line-Following robot using Arduino Uno that can autonomously pick up boxes autonomously in a warehouse. By integrating a car chassis with an artificial intelligence (AI) camera, the robot will be able to follow the line path automatically, while the mechanized robot arm can pick up parcels of up to 0.1 KG all while being autonomous. …”
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    Final Year Project (FYP)
  18. 158

    Study of heat transfer through micro-structured surfaces by Chin, Wei Hao

    Published 2016
    “…Each chip has a different microstructure in the form of very small and elongated pin-fins, which will in turn affect the critical heat flux of each component. …”
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    Final Year Project (FYP)
  19. 159
  20. 160

    Cold forging die design assisted by finite element simulation by Liu, Yi Ming.

    Published 2008
    “…In this study, a copper heat sink, which is an electronic component with heat sinking function, is identified as a sample to verify the effectiveness of finite element simulation.…”
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    Thesis