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pinnau » pinna (Expand Search), pinnae (Expand Search)
pinge » ping (Expand Search), hinge (Expand Search), pine (Expand Search)
linge » line (Expand Search), hinge (Expand Search), lange (Expand Search), longe (Expand Search), linee (Expand Search), linke (Expand Search)
ling » long (Expand Search), line (Expand Search), link (Expand Search)
min » main (Expand Search)
ming » maing (Expand Search)
bina » bin (Expand Search), bing (Expand Search)
ssbina » ssbin (Expand Search), ssbing (Expand Search), sabina (Expand Search)
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481
The Sixth Trilateral Summit: Style Over Substance?
Published 2015Get full text
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Commentary -
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A Japan with Fewer Japanese: Enter the Machines
Published 2017Get full text
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Commentary -
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Practical support structures for selective laser melting
Published 2018Get full text
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Temperature and stress distribution in the SOI structure during fabrication
Published 2009“…Although it is expected that the furnace temperature and withdrawal velocity are the key factors in determining the mechanical stresses, for the present bonding strength of wafers via wafer bonding technology, the withdrawal velocity must be less than 100 mm/min, and under such a withdrawal velocity, the furnace temperature is also an insignificant factor with regard to the induced stress.…”
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User experience of architectural detailing in virtual urban environment /
Published 2017software, multimedia -
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