Showing 661 - 680 results of 6,902 for search '((pinnau OR pingsed) OR ((pick OR (((link OR line) OR (ming OR spina)) OR (min OR main))) OR pin))', query time: 0.20s Refine Results
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    Additive-free electrophoretic deposition of graphene quantum dots thin films by Nguyen, Tam D., Geuli, Ori, Yeo, Loo Pin, Magdassi, Shlomo, Mandler, Daniel, Tok, Alfred Iing Yoong

    Published 2021
    “…The GQD thin films can be deposited onto ITO with optimal surface morphology at 30 V in 5 min (surface roughness of approximately (3.1±1.3) nm). …”
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    Journal Article
  11. 671

    The effectiveness of different types of monetary incentives to download the TraceTogether application by Lim, Mei Hui, Liu, Lingshan, Ng, Shu Min

    Published 2021
    “…This group was asked whether they would download it without any mention of monetary incentives. The main findings of this study were (i) Participants were more willing to download the TraceTogether application with monetary incentives compared to no monetary incentives, (ii) All participants in the “choice” group chose to receive direct payment, (iii) Most participants believed that direct payment would result in the highest number of people downloading a contact tracing application, (iv) “Direct payment”, “gift card” and “choice” had statistically lower minimum WTA than “charity donation” and (v) There is no statistically significant difference between the minimum WTA of “choice” and “direct payment”, “direct payment” and “gift card”, as well as “gift card” and “choice”.…”
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    Final Year Project (FYP)
  12. 672

    Cryogelation of human hair keratins by Chua, Huei Min, Zhao, Zhitong, Ng, Kee Woei

    Published 2021
    “…These findings show that macroscale properties of HHK cryogels can be conveniently modulated by physical parameters of cryogelation and that disulfide bonding is the main stabilizing force in HHK cryogels.…”
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    Journal Article
  13. 673

    Capacitive discharge based transient analysis with fault detection methodology in DC system by Yeap, Yew Ming, Geddada, Nagesh, Ukil, Abhisek

    Published 2020
    “…This paper presents a transient analysis based on DC-link capacitive discharge which can be leveraged to design a fault detection method. …”
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    Journal Article
  14. 674

    Temperature and stress distribution in the SOI structure during fabrication by Tan, Cher Ming, Gan, Zhenghao, Gao, Xiaofang

    Published 2009
    “…Although it is expected that the furnace temperature and withdrawal velocity are the key factors in determining the mechanical stresses, for the present bonding strength of wafers via wafer bonding technology, the withdrawal velocity must be less than 100 mm/min, and under such a withdrawal velocity, the furnace temperature is also an insignificant factor with regard to the induced stress.…”
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    Journal Article
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