Showing 1,381 - 1,400 results of 5,117 for search '((pinned OR ((fine OR like) OR linene)) OR ((aina OR (pin OR wing)) OR min))', query time: 0.19s Refine Results
  1. 1381

    Peaceful protest by Chen, Jessical Kailin

    Published 2022
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    Final Year Project (FYP)
  2. 1382
  3. 1383

    Buta huruf by Addini Binte Jalani

    Published 2023
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    Final Year Project (FYP)
  4. 1384

    Under the Roof by Cheah, Sue Lyn

    Published 2023
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    Final Year Project (FYP)
  5. 1385

    Covert by Chia, Celeste Yi Ying

    Published 2023
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    Final Year Project (FYP)
  6. 1386

    Filament winding of thermoplastic composite pipes for engineering applications by Lim, Samuel

    Published 2023
    “…The aim of this study was to optimize the fabrication process of filament winding of thermoplastic composite pipes through fine-tuning parameters and explore how different fabrication process parameters can potentially affect its final properties. …”
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    Final Year Project (FYP)
  7. 1387

    Drawing memories. by Chang, Jerly Wei Kiang.

    Published 2010
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    Final Year Project (FYP)
  8. 1388

    XYZ translation by Au, Chong Weng

    Published 2010
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    Final Year Project (FYP)
  9. 1389

    The Scene. by Lim, Rachel Shi Ean.

    Published 2010
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    Final Year Project (FYP)
  10. 1390

    Design and development of a micromachined vibratory gyroscope with enhanced mechanical sensitivity by Leow, Kok Wah.

    Published 2011
    “…Most of the current research activities in micromachined gyroscope are focusing on the design of a single resonator to increase mechanical sensitivity and performance. These aim to fine tuning the design factors that directly affect the vibration characteristic of the resonator in order to improve the sensitivity. …”
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    Thesis
  11. 1391
  12. 1392
  13. 1393
  14. 1394

    Parachute kids by Wah, Hubert Yun Teng

    Published 2013
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    Final Year Project (FYP)
  15. 1395

    Coda. by Zurianah Hashim.

    Published 2013
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    Final Year Project (FYP)
  16. 1396
  17. 1397
  18. 1398
  19. 1399

    Package and board level reliability modeling of advanced CSP pakages for telecommunication applications by Tee, Tong Yan

    Published 2008
    “…These technology requirements are possible with the recent development of advanced Chip Scale Packages (CSPs), such as thin-profile fine-pitch Ball Grid Array (TFBGA), Quad-Flat-No-lead (QFN), and wafer-level CSP (WL-CSP). …”
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    Thesis
  20. 1400

    Enhancing sentiment analysis on social media data by Ruan, Pingcheng

    Published 2016
    “…This report explains my extensive research on the engine’s improvement from the following three perspectives: Fine-grained analysis of the sentiment including specific emotions, associate the sentiment with the topics and compute a domain-specific word’s polarity. …”
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    Final Year Project (FYP)