Showing 1,341 - 1,360 results of 2,561 for search '((sfine OR ((pine OR peng) OR line)) OR ((pins OR spina) OR ping))', query time: 0.17s Refine Results
  1. 1341

    Twisted formalism for 3d N=4 theories by Garner, N

    Published 2024
    “…We rederive many known results from this perspective, including state spaces on Riemann surfaces, deformations induced by flavor symmetries, the boundary VOAs of Costello–Gaiotto, and the category of line operators as proposed by Costello–Dimofte–Gaiotto–Hilburn–Yoo. …”
    Journal article
  2. 1342

    The papal tiara in sacred historiography by Pattenden, M

    Published 2024
    “…Early Modern Catholic writers developed a consistent line of inquiry into the tiara based on an evolving agenda to affirm the pope’s majesty. …”
    Journal article
  3. 1343

    Droplet wetting and evaporation on hydrophilic and hydrophobic surfaces by Phonkrit, Boonchuaysream

    Published 2020
    “…The droplets also experience contact line pinning-depinning during the CCA and mixed modes on patterned substrates. …”
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    Final Year Project (FYP)
  4. 1344
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  16. 1356

    Building AC/DC microgrid design by Li, ChengJing

    Published 2017
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    Final Year Project (FYP)
  17. 1357
  18. 1358

    21W.742J / SP.575J / WGS.575J Writing About Race, Spring 2003 by Faery, Rebecca Blevins

    Published 2003
    “…Du Bois wrote that "…the problem of the Twentieth Century is the problem of the color line." A century after Du Bois penned those words, most Americans would agree that at the beginning of the twenty-first century, the color line remains one of our most pressing social issues. …”
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    Learning Object
  19. 1359
  20. 1360

    Deep learning based solder joint defect detection on industrial printed circuit board X-ray images by Zhang, Qianru, Zhang, Meng, Gamanayake, Chinthaka, Yuen, Chau, Geng, Zehao, Jayasekara, Hirunima, Woo, Chia-wei, Low, Jenny, Liu, Xiang, Guan, Yong Liang

    Published 2023
    “…With the improvement of electronic circuit production methods, such as reduction of component size and the increase of component density, the risk of defects is increasing in the production line. Many techniques have been incorporated to check for failed solder joints, such as X-ray imaging, optical imaging and thermal imaging, among which X-ray imaging can inspect external and internal defects. …”
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    Journal Article