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    Temperature and stress distribution in the SOI structure during fabrication by Tan, Cher Ming, Gan, Zhenghao, Gao, Xiaofang

    Published 2009
    “…Although it is expected that the furnace temperature and withdrawal velocity are the key factors in determining the mechanical stresses, for the present bonding strength of wafers via wafer bonding technology, the withdrawal velocity must be less than 100 mm/min, and under such a withdrawal velocity, the furnace temperature is also an insignificant factor with regard to the induced stress.…”
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    Journal Article
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    以“才”充“再”?以“再”充“才”?新加坡华语里“才”和“再”的使用情况 = Study of the usage of adverb cai and adverb zai in Singapore Chinese by 余依霖 Er, Yee Ling

    Published 2009
    “…As a concluding remark, it is proposed that as long as such pragmatic phenomenon conforms to the two standardization principles, it should be allowed. …”
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    Final Year Project (FYP)
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