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spie » spin (Expand Search)
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swing » wing (Expand Search), shing (Expand Search)
spie » spin (Expand Search)
line » like (Expand Search), life (Expand Search)
ping » ling (Expand Search), ying (Expand Search)
ming » min (Expand Search), ling (Expand Search)
swing » wing (Expand Search), shing (Expand Search)
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521
Development of control system for flapping wing micro air vehicles
Published 2017Get full text
Final Year Project (FYP) -
522
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523
Sanctions with Chinese characteristics : the effects of China's sanctions rhetoric on its behaviour
Published 2018Get full text
Thesis-Doctor of Philosophy -
524
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525
Optimizing Android smartphone’s user experience and power efficiency through governor and scheduler customization
Published 2018Get full text
Final Year Project (FYP) -
526
Ce yin zhi xin in the Mencius : being concerned for the other
Published 2019Get full text
Final Year Project (FYP) -
527
Investigating accuracy of contour interpolation in modal and amodal completion
Published 2019Get full text
Final Year Project (FYP) -
528
Scratch based graphical programming online guide/exam system
Published 2019Get full text
Final Year Project (FYP) -
529
Degradation of plastic waste due to wave action
Published 2019Get full text
Final Year Project (FYP) -
530
Simultaneous Measurement of Torsion and Temperature Based on Helical Structure in Multicore Fiber
Published 2017Get full text
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Conference Paper -
531
Field instrumentation for monitoring of water, heat, and gas transfers through unsaturated soils
Published 2013Get full text
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Journal Article -
532
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533
Forced convection and sub-cooled flow boiling heat transfer from electronic chips
Published 2008“…Experiments are performed to study the single-phase forced convection heat transfer and subcooled flow boiling heat transfer from an in-line four simulated chips in a rectangular channel using water & FC-72.…”
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Research Report -
534
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535
3D simulation-based research on the effect of interconnect structures on circuit reliability
Published 2015“…The simulation of the EM reliability of the interconnects is usually performed using the line-via structure at the EM test temperature (e.g. 300 oC).However, such simulation using the line-via structure may not give the same void nucleation location as in the real circuit structure, especially at the circuit operation temperature (e.g. 90C). …”
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Journal Article -
536
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537
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538
古典文学中的“戏妻”、“试妻”现象 = An analysis of "Husband Teasing wife" in classical Chinese literature
Published 2017“…Thus, the “Husband Teasing Wife” plot gradually developed and was inherited by later works. From the Ming Dynasty onwards, “Husband Teasing Wife” mainly exists in the form of “Husband Testing Wife”. …”
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Final Year Project (FYP) -
539
Measuring shear wave velocity using bender elements
Published 2011Get full text
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Journal Article -
540
Failures in computer contracts in the Eastern part of the United States.
Published 2014Get full text
Final Year Project (FYP)