Showing 1,941 - 1,960 results of 2,805 for search '((spike OR (min OR line)) OR ((spine OR (pinga OR spinggga)) OR pin))', query time: 0.16s Refine Results
  1. 1941
  2. 1942
  3. 1943

    Flexural behavior of epoxy-carbon composite with diffusion effect by Seah, Leong Keey, Wang, Zhiying, Zhao, Yian, Chai, Gin Boay

    Published 2018
    “…At each temperature, the testing was conducted at four different cross head speeds (0.05, 0.2, 2 and 20mm/min). The diffusion effect was studied on flexural strength with specimens soaked in sea water at 50°C to saturate. …”
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    Conference Paper
  4. 1944

    On linear complementary pairs of codes by Solé, Patrick, Carlet, Claude, Güneri, Cem, Özbudak, Ferruh, Özkaya, Buket

    Published 2019
    “…Hence, the security parameter min(d(C), d(D⊥)) for LCP of codes is simply determined by one of the codes in this case. …”
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    Journal Article
  5. 1945
  6. 1946
  7. 1947
  8. 1948
  9. 1949
  10. 1950
  11. 1951
  12. 1952
  13. 1953
  14. 1954
  15. 1955
  16. 1956
  17. 1957

    Slip on the Superstition Hills fault and on nearby faults associated with the 24 November 1987 Elmore Ranch and Superstition Hills earthquakes, southern California by Sieh, Kerry, McGill, Sally F., Allen, Clarence R., Hudnut, Kenneth W., Johnson, David C., Miller, Wayne F.

    Published 2013
    “…Telemetered data from creepmeters on the southern San Andreas and Imperial faults indicate that triggered slip began there within 3 min or less of each of the two earthquakes. Additional triggered slip occurred on the Imperial fault beginning 3.5 hr after the second earthquake.…”
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    Journal Article
  18. 1958

    Chemical analysis of silica doped hydroxyapatite biomaterials consolidated by a spark plasma sintering method by Xu, Jinling, Khor, Khiam Aik

    Published 2012
    “…After spray drying into micron sized powders, the silica doped HA (SiHA) powders were consolidated at 1000 C with a dwell time of 3 min using a spark plasma sintering (SPS) technique. …”
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    Journal Article
  19. 1959
  20. 1960

    Comparison of different molds (epoxy, polymer and silicon) for microfabrication by hot embossing technique by Gupta, A., Tang, P. S., Jena, Rajeeb Kumar, Yue, Chee Yoon, Lam, Yee Cheong

    Published 2013
    “…At the optimum embossing conditions (i.e. 100 °C, 2.94 kN load and 5 min loading time), all three molds had similar performance in terms of replication fidelity. …”
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    Journal Article