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spike » spie (Expand Search)
line » like (Expand Search), life (Expand Search)
pin » ping (Expand Search), spin (Expand Search)
ming » min (Expand Search), ling (Expand Search)
sling » esling (Expand Search), ling (Expand Search), shing (Expand Search)
wing » wang (Expand Search), wong (Expand Search), ling (Expand Search)
owing » owang (Expand Search), owong (Expand Search), oling (Expand Search)
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501
Web development for energy management system of a microgrid
Published 2015Get full text
Final Year Project (FYP) -
502
The antecedents and consequences of a layered architecture of mobile handsets
Published 2015Get full text
Thesis -
503
Land reclamation in Singapore : a history of governmental approaches to coastal development and management
Published 2016Get full text
Final Year Project (FYP) -
504
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505
Output feedback control of a new hybrid boost converter
Published 2017Get full text
Final Year Project (FYP) -
506
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507
Sanctions with Chinese characteristics : the effects of China's sanctions rhetoric on its behaviour
Published 2018Get full text
Thesis-Doctor of Philosophy -
508
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509
Optimizing Android smartphone’s user experience and power efficiency through governor and scheduler customization
Published 2018Get full text
Final Year Project (FYP) -
510
Ce yin zhi xin in the Mencius : being concerned for the other
Published 2019Get full text
Final Year Project (FYP) -
511
Investigating accuracy of contour interpolation in modal and amodal completion
Published 2019Get full text
Final Year Project (FYP) -
512
Scratch based graphical programming online guide/exam system
Published 2019Get full text
Final Year Project (FYP) -
513
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514
Integrating environmental management practices with strategic planning process.
Published 2008Get full text
Final Year Project (FYP) -
515
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516
Field instrumentation for monitoring of water, heat, and gas transfers through unsaturated soils
Published 2013Get full text
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Journal Article -
517
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518
3D simulation-based research on the effect of interconnect structures on circuit reliability
Published 2015“…The simulation of the EM reliability of the interconnects is usually performed using the line-via structure at the EM test temperature (e.g. 300 oC).However, such simulation using the line-via structure may not give the same void nucleation location as in the real circuit structure, especially at the circuit operation temperature (e.g. 90C). …”
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Journal Article -
519
Measuring shear wave velocity using bender elements
Published 2011Get full text
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Journal Article -
520
Failures in computer contracts in the Eastern part of the United States.
Published 2014Get full text
Final Year Project (FYP)