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    3D simulation-based research on the effect of interconnect structures on circuit reliability by He, Feifei, Tan, Cher Ming

    Published 2015
    “…The simulation of the EM reliability of the interconnects is usually performed using the line-via structure at the EM test temperature (e.g. 300 oC).However, such simulation using the line-via structure may not give the same void nucleation location as in the real circuit structure, especially at the circuit operation temperature (e.g. 90C). …”
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    Journal Article
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    古典文学中的“戏妻”、“试妻”现象 = An analysis of "Husband Teasing wife" in classical Chinese literature by 郑慧萍 Tay, Hui Ping

    Published 2017
    “…Thus, the “Husband Teasing Wife” plot gradually developed and was inherited by later works. From the Ming Dynasty onwards, “Husband Teasing Wife” mainly exists in the form of “Husband Testing Wife”. …”
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    Final Year Project (FYP)
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