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    Data analytics on maps by Boey, Jackson Ming Hui

    Published 2018
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    Final Year Project (FYP)
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    Forced convection and sub-cooled flow boiling heat transfer from electronic chips by Tou, Kwok Woon., Tso, Chih Ping.

    Published 2008
    “…Experiments are performed to study the single-phase forced convection heat transfer and subcooled flow boiling heat transfer from an in-line four simulated chips in a rectangular channel using water & FC-72.…”
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    Research Report
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    3D simulation-based research on the effect of interconnect structures on circuit reliability by He, Feifei, Tan, Cher Ming

    Published 2015
    “…The simulation of the EM reliability of the interconnects is usually performed using the line-via structure at the EM test temperature (e.g. 300 oC).However, such simulation using the line-via structure may not give the same void nucleation location as in the real circuit structure, especially at the circuit operation temperature (e.g. 90C). …”
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    Journal Article