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Showing 921 - 940 results of 1,512 for search '((spinae OR (spike OR fine)) OR ((bina OR (spingg OR (sspingg OR sspinggg))) OR (pin OR spin)))', query time: 0.16s Refine Results
  1. 921

    Under the Roof by Cheah, Sue Lyn

    Published 2023
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    Final Year Project (FYP)
  2. 922

    Covert by Chia, Celeste Yi Ying

    Published 2023
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    Final Year Project (FYP)
  3. 923

    Filament winding of thermoplastic composite pipes for engineering applications by Lim, Samuel

    Published 2023
    “…The aim of this study was to optimize the fabrication process of filament winding of thermoplastic composite pipes through fine-tuning parameters and explore how different fabrication process parameters can potentially affect its final properties. …”
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    Final Year Project (FYP)
  4. 924

    Hierarchical feature attention with bottleneck attention modules for multi-branch classification by Gan, Ryan

    Published 2024
    “…While existing attention mechanisms often focus on pre-processing images, fine-grained classification tasks benefit from leveraging hierarchical relationships within categories. …”
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    Final Year Project (FYP)
  5. 925

    Drawing memories. by Chang, Jerly Wei Kiang.

    Published 2010
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    Final Year Project (FYP)
  6. 926

    XYZ translation by Au, Chong Weng

    Published 2010
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    Final Year Project (FYP)
  7. 927

    The Scene. by Lim, Rachel Shi Ean.

    Published 2010
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    Final Year Project (FYP)
  8. 928

    Design and development of a micromachined vibratory gyroscope with enhanced mechanical sensitivity by Leow, Kok Wah.

    Published 2011
    “…Most of the current research activities in micromachined gyroscope are focusing on the design of a single resonator to increase mechanical sensitivity and performance. These aim to fine tuning the design factors that directly affect the vibration characteristic of the resonator in order to improve the sensitivity. …”
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    Thesis
  9. 929
  10. 930
  11. 931
  12. 932

    Parachute kids by Wah, Hubert Yun Teng

    Published 2013
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    Final Year Project (FYP)
  13. 933

    Coda. by Zurianah Hashim.

    Published 2013
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    Final Year Project (FYP)
  14. 934
  15. 935
  16. 936

    Development of indexing clamper mechanism for wire bonder by Zhang, Yue.

    Published 2008
    “…For wire bonding integrated circuits, the state-of-art is 30 u.m fine pitch, and the position accuracy of material transmission for wire bonder is required to be 3.5 urn or less. …”
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    Thesis
  17. 937
  18. 938
  19. 939
  20. 940

    Package and board level reliability modeling of advanced CSP pakages for telecommunication applications by Tee, Tong Yan

    Published 2008
    “…These technology requirements are possible with the recent development of advanced Chip Scale Packages (CSPs), such as thin-profile fine-pitch Ball Grid Array (TFBGA), Quad-Flat-No-lead (QFN), and wafer-level CSP (WL-CSP). …”
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    Thesis