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spine » spin (Expand Search), spie (Expand Search), spike (Expand Search), sspine (Expand Search)
line » like (Expand Search), life (Expand Search)
san » span (Expand Search)
pin » spin (Expand Search)
pina » spina (Expand Search), bina (Expand Search), aina (Expand Search), nina (Expand Search)
ping » sping (Expand Search), ling (Expand Search), ming (Expand Search), ying (Expand Search)
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2761
Analysis of tourism demand serial dependence structure for forecasting
Published 2017Get full text
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Journal Article -
2762
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2763
Surface modification of additive manufactured components by ultrasonic cavitation abrasive finishing
Published 2017“…Results have demonstrated that this technique improves Ra values of as-built Inconel 625 side surfaces by up to 45% after 30 min of processing time. Scanning electron microscopic images revealed that most small-sized partially melted powders were removed through heterogeneous cavitation nucleation on the specimens’ rough initial surface. …”
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Journal Article -
2764
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2765
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2766
Thermodynamics of complexity and pattern manipulation
Published 2018Get full text
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Journal Article -
2767
Achieving secure and privacy-preserving incentive in vehicular cloud advertisement dissemination
Published 2018Get full text
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Journal Article -
2768
The recent development and applications of fluidic channels by 3D printing
Published 2018Get full text
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Journal Article -
2769
The Performance and Fouling Control of Submerged Hollow Fiber (HF) Systems: A Review
Published 2018Get full text
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Journal Article -
2770
Surface enhanced Raman spectroscopy for malaria diagnosis and intradermal measurements
Published 2018Get full text
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Journal Article -
2771
Optically reversible electrical soft-breakdown in wide-bandgap oxides — a factorial study
Published 2019Get full text
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Journal Article -
2772
Mechanisms of ciliary targeting: entering importins and Rabs
Published 2018Get full text
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Journal Article -
2773
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2774
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2775
Ultrasensitive measurement of gas refractive index using an optical nanofiber coupler
Published 2019Get full text
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Journal Article -
2776
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2777
Temperature and stress distribution in the SOI structure during fabrication
Published 2009“…Although it is expected that the furnace temperature and withdrawal velocity are the key factors in determining the mechanical stresses, for the present bonding strength of wafers via wafer bonding technology, the withdrawal velocity must be less than 100 mm/min, and under such a withdrawal velocity, the furnace temperature is also an insignificant factor with regard to the induced stress.…”
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Journal Article -
2778
System crash as dynamics of complex networks
Published 2017Get full text
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Journal Article -
2779
White light single-shot interferometry with colour CCD camera for optical inspection of microsystems
Published 2015Get full text
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Conference Paper -
2780
Effect of processing parameters on electroless Cu seed layer properties
Published 2012“…Of particular interest is that there exists a preferred Cu (111) crystal orientation in the samples subjected to more than as short as 3 min of deposition. A surface roughness (Rrms) of ∼17 nm has been achieved. …”
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Journal Article