Showing 1,461 - 1,480 results of 3,305 for search '((ssainae OR line) OR (((((pina OR yong) OR bina) OR ling) OR (pingat OR ping)) OR shing))', query time: 0.23s Refine Results
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    Functional analysis of germline RAD51C missense variants highlight the role of RAD51C in replication fork protection by Kolinjivadi, Arun Mouli, Chong, Siao Ting, Choudhary, Ramveer, Sankar, Haresh, Chew, Ee Ling, Yeo, Claresta, Chan, Sock Hoai, Ngeow, Joanne

    Published 2023
    “…Investigations using patient-derived lymphoblastoid cell line carrying heterozygous RAD51C L134S variant showed an impairment in RAD51 chromatin association and replication fork protection, suggestive of deleteriousness of this VUS variant. …”
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    Journal Article
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  15. 1475

    Holmium doped yttria transparent ceramics for 2-μm solid state lasers by Wang, Jun, Zhao, Yongguang, Yin, Danlei, Liu, Peng, Ma, Jie, Wang, Ying, Shen, Deyuan, Dong, Zili, Kong, Ling Bing, Tang, Dingyuan

    Published 2019
    “…Vacuum sintered at 1500 °C for 12 h followed by HIPing at 1450 °C for 4 h, the Ho:Y2O3 ceramics showed excellent in-line transmission and uniform grain size, with an average grain size of about 1 μm. …”
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    Journal Article
  16. 1476

    A novel eukaryotic RdRP-dependent small RNA pathway represses antiviral immunity by controlling an ERK pathway component in the black-legged tick by Feng, Canran, Torimaru, Kyosuke, Lim, Mandy Yu Theng, Chak, Li-Ling, Shiimori, Masami, Tsuji, Kosuke, Tanaka, Tetsuya, Iida, Junko, Okamura, Katsutomo

    Published 2023
    “…Here, we study sRNAs in the ISE6 cell line, which is derived from the black-legged tick, an important vector of human and animal pathogens. …”
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    Journal Article
  17. 1477

    Deep learning based solder joint defect detection on industrial printed circuit board X-ray images by Zhang, Qianru, Zhang, Meng, Gamanayake, Chinthaka, Yuen, Chau, Geng, Zehao, Jayasekara, Hirunima, Woo, Chia-wei, Low, Jenny, Liu, Xiang, Guan, Yong Liang

    Published 2023
    “…With the improvement of electronic circuit production methods, such as reduction of component size and the increase of component density, the risk of defects is increasing in the production line. Many techniques have been incorporated to check for failed solder joints, such as X-ray imaging, optical imaging and thermal imaging, among which X-ray imaging can inspect external and internal defects. …”
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    Journal Article
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