Showing 2,241 - 2,260 results of 7,225 for search '((sssspinge OR (find OR (finene OR fineness))) OR ((((pin OR pink) OR spings) OR ping) OR min))', query time: 0.20s Refine Results
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    Temperature and stress distribution in the SOI structure during fabrication by Tan, Cher Ming, Gan, Zhenghao, Gao, Xiaofang

    Published 2009
    “…Although it is expected that the furnace temperature and withdrawal velocity are the key factors in determining the mechanical stresses, for the present bonding strength of wafers via wafer bonding technology, the withdrawal velocity must be less than 100 mm/min, and under such a withdrawal velocity, the furnace temperature is also an insignificant factor with regard to the induced stress.…”
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    Effect of processing parameters on electroless Cu seed layer properties by Chen, Z., Chan, L., See, Alex K. H., Law, S. B., Zeng, K. Y., Shen, L., Tee, K. C., Ee, Elden Yong Chiang

    Published 2012
    “…Of particular interest is that there exists a preferred Cu (111) crystal orientation in the samples subjected to more than as short as 3 min of deposition. A surface roughness (Rrms) of ∼17 nm has been achieved. …”
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    Spark plasma reaction sintering of ZrO2-mullite composites from plasma spheroidized zircon/alumina powders by Yu, L. G., Li, Y., Munir, Z. A., Khor, Khiam Aik, Dong, Zhili

    Published 2012
    “…Mullite-zirconia ceramic composites are prepared by reaction sintering of plasma spheroidized (PS) zircon-alumina powders in a spark plasma sintering (SPS) system at 1000, 1100, 1200 and 1300 °C with duration of 10 and 30 min. At SPS temperature of 1000 °C, evidence of zircon decomposition is detected, while at 1200 °C, mullite formation dominates the process, resulting in significant increases in microhardness, Young’s modulus and fracture toughness values. …”
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