Showing 2,161 - 2,180 results of 6,541 for search '((ssssspenge OR (find OR finene)) OR ((((pin OR pink) OR spings) OR ping) OR min))', query time: 0.17s Refine Results
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    Surface modification of additive manufactured components by ultrasonic cavitation abrasive finishing by Tan, Kai Liang, Yeo, Song Huat

    Published 2017
    “…Results have demonstrated that this technique improves Ra values of as-built Inconel 625 side surfaces by up to 45% after 30 min of processing time. Scanning electron microscopic images revealed that most small-sized partially melted powders were removed through heterogeneous cavitation nucleation on the specimens’ rough initial surface. …”
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    Journal Article
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    Temperature and stress distribution in the SOI structure during fabrication by Tan, Cher Ming, Gan, Zhenghao, Gao, Xiaofang

    Published 2009
    “…Although it is expected that the furnace temperature and withdrawal velocity are the key factors in determining the mechanical stresses, for the present bonding strength of wafers via wafer bonding technology, the withdrawal velocity must be less than 100 mm/min, and under such a withdrawal velocity, the furnace temperature is also an insignificant factor with regard to the induced stress.…”
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