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  1. 1261
    Under the Roof

    Under the Roof by Cheah, Sue Lyn

    Published 2023
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    Final Year Project (FYP)
  2. 1262
    Covert

    Covert by Chia, Celeste Yi Ying

    Published 2023
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    Final Year Project (FYP)
  3. 1263
    Filament winding of thermoplastic composite pipes for engineering applications

    Filament winding of thermoplastic composite pipes for engineering applications by Lim, Samuel

    Published 2023
    “…The aim of this study was to optimize the fabrication process of filament winding of thermoplastic composite pipes through fine-tuning parameters and explore how different fabrication process parameters can potentially affect its final properties. …”
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    Final Year Project (FYP)
  4. 1264
    Hierarchical feature attention with bottleneck attention modules for multi-branch classification

    Hierarchical feature attention with bottleneck attention modules for multi-branch classification by Gan, Ryan

    Published 2024
    “…While existing attention mechanisms often focus on pre-processing images, fine-grained classification tasks benefit from leveraging hierarchical relationships within categories. …”
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    Final Year Project (FYP)
  5. 1265
    Drawing memories.

    Drawing memories. by Chang, Jerly Wei Kiang.

    Published 2010
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    Final Year Project (FYP)
  6. 1266
    XYZ translation

    XYZ translation by Au, Chong Weng

    Published 2010
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    Final Year Project (FYP)
  7. 1267
    The Scene.

    The Scene. by Lim, Rachel Shi Ean.

    Published 2010
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    Final Year Project (FYP)
  8. 1268
    Design and development of a micromachined vibratory gyroscope with enhanced mechanical sensitivity

    Design and development of a micromachined vibratory gyroscope with enhanced mechanical sensitivity by Leow, Kok Wah.

    Published 2011
    “…Most of the current research activities in micromachined gyroscope are focusing on the design of a single resonator to increase mechanical sensitivity and performance. These aim to fine tuning the design factors that directly affect the vibration characteristic of the resonator in order to improve the sensitivity. …”
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    Thesis
  9. 1269
    Tales of the Chugawagas : from conception to production.

    Tales of the Chugawagas : from conception to production. by Khoo, Yi Hui.

    Published 2011
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    Final Year Project (FYP)
  10. 1270
    Ideal houses : a visual research case study on factors that define a house.

    Ideal houses : a visual research case study on factors that define a house. by Loh, Li Ying.

    Published 2011
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    Final Year Project (FYP)
  11. 1271
    Look on the bright sight : an illustration project inspired by three visually-impaired photographers.

    Look on the bright sight : an illustration project inspired by three visually-impaired photographers. by Ng, Jill Hui Wen.

    Published 2011
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    Final Year Project (FYP)
  12. 1272
    Parachute kids

    Parachute kids by Wah, Hubert Yun Teng

    Published 2013
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    Final Year Project (FYP)
  13. 1273
    Coda.

    Coda. by Zurianah Hashim.

    Published 2013
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    Final Year Project (FYP)
  14. 1274
    30 x 30 : visual branding in trash

    30 x 30 : visual branding in trash by Farhana, Ja'afar

    Published 2013
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    Final Year Project (FYP)
  15. 1275
    Old wives' tales, did you believe?

    Old wives' tales, did you believe? by Lio, Jen Yun.

    Published 2013
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    Final Year Project (FYP)
  16. 1276
    Development of indexing clamper mechanism for wire bonder

    Development of indexing clamper mechanism for wire bonder by Zhang, Yue.

    Published 2008
    “…For wire bonding integrated circuits, the state-of-art is 30 u.m fine pitch, and the position accuracy of material transmission for wire bonder is required to be 3.5 urn or less. …”
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    Thesis
  17. 1277
    Abui stories : seven children

    Abui stories : seven children by Chew, Grace Min Hui

    Published 2014
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    Final Year Project (FYP)
  18. 1278
    Elephant in the room

    Elephant in the room by Muhammad Iskandar Thani BMB, Ng, Qin Ching

    Published 2014
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    Final Year Project (FYP)
  19. 1279
    Discovering patterns of interconnectedness

    Discovering patterns of interconnectedness by Lee, Zhao Pei

    Published 2015
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    Final Year Project (FYP)
  20. 1280
    Package and board level reliability modeling of advanced CSP pakages for telecommunication applications

    Package and board level reliability modeling of advanced CSP pakages for telecommunication applications by Tee, Tong Yan

    Published 2008
    “…These technology requirements are possible with the recent development of advanced Chip Scale Packages (CSPs), such as thin-profile fine-pitch Ball Grid Array (TFBGA), Quad-Flat-No-lead (QFN), and wafer-level CSP (WL-CSP). …”
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    Thesis

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