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ceers » peers (Expand Search), beers (Expand Search), cers (Expand Search)
chen » when (Expand Search)
cheers » cheer (Expand Search), cheaters (Expand Search), checkers (Expand Search)
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181
Dynamic mechanical behaviors of laser sintered polyurethane incorporated with mwcnts
Published 2016Get full text
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Conference Paper -
182
Additive Manufacturing for Active Electronic Components: A Review
Published 2016Get full text
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Conference Paper -
183
Accuracy of second order perturbation theory in the polaron and variational polaron frames
Published 2013Get full text
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Journal Article -
184
Fault-tolerant computation meets network coding: optimal scheduling in parallel computing
Published 2023Get full text
Journal Article -
185
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186
Mental task design based on EEG signal for brain computer interface system.
Published 2023Get full text
Article -
187
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188
Consolidation in the Singapore insurance Industry.
Published 2008Get full text
Final Year Project (FYP) -
189
A study on the employee stock option plan in Singapore.
Published 2008Get full text
Final Year Project (FYP) -
190
The analysis and calibration of a multi-factor hull-white model.
Published 2008Get full text
Thesis -
191
Multi cue approach to country-of-origin effect.
Published 2008Get full text
Final Year Project (FYP) -
192
Development of liquid crystalline polymer blends for the electronic industry
Published 2008Get full text
Research Report -
193
On the study of keyhole-mode melting in selective laser melting process
Published 2020Get full text
Journal Article -
194
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195
MARS inverse analysis of soil and wall properties for braced excavations in clays
Published 2019Get full text
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Journal Article -
196
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197
Proactively modulating mechanical behaviors of materials at multiscale for mechano-adaptable devices
Published 2020Get full text
Journal Article -
198
Sustainability and interactivity between cities and ports : a two-stage data envelopment analysis (DEA) approach
Published 2020Get full text
Journal Article -
199
The role of online media in mobilizing large-scale collective action
Published 2021Get full text
Journal Article -
200
Evaluation of process requirements for room temperature direct copper bonding
Published 2009Get full text
Final Year Project (FYP)