Fracture toughness assessment of a solder joint using double cantilever beam specimens by Lee, Adeline Puay Chen, Lim, Zan Xuan, Yantara, Natalia, Loo, Shane Zhi Yuan, Tee, Tong Yan, Tan, Cher Ming, Chen, Zhong

“…Conventional assessment of solder joint reliability uses either ball shear test or solder ball pull test. The test results are reported in terms of materials strength in either shear or tensile mode, and the strength values are size-dependent. …”
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Business study mission : Ireland cultural intelligence, Huawei Technologies Co. Ltd by Chen, Fang, Endang Astharanti, Waizly Darwin, Chua, Dennis Chee Cheong

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Effect of chain length on low temperature gold-gold bonding by self assembled monolayers by Ang, X. F., Chen, Z., Wong, Chee C., Wei, J.

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Effect of deep cold rolling on residual stress distributions between the treated and untreated regions Ti–6Al–4V alloy by Lim, Andre, Castagne, Sylvie, Chow, Cher Wong

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Temperature and stress distribution in the SOI structure during fabrication by Tan, Cher Ming, Gan, Zhenghao, Gao, Xiaofang

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Comparison of diagnostic performance and inter-reader agreement between PI-RADS v2.1 and PI-RADS v2: systematic review and meta-analysis by Lee, Chau Hung, Vellayappan, Balamurugan, Tan, Cher Heng

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The happiness revolution : live life now. by Hong, Shuqi., Cher, Fiona., Lin, Huanyu., Rusydi, Izzat.

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Erasure temperature measurements of heat assisted magnetic recording media by Chen, Y. J., Yang, H. Z., Leong, S. H., Cher, K. M., Hu, J. F., Sethi, P., Lew, Wen Siang

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Soil liquefaction assessment using soft computing approaches based on capacity energy concept by Chen, Zhixiong, Li, Hongrui, Goh, Anthony Teck Chee, Wu, Chongzhi, Zhang, Wengang

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Critical temperatures in thermocompression gold stud bonding by Zhang, G. G., Ang, X. F., Chen, Z., Wong, Chee C., Wei, J.

“…Under similar bonding conditions, the critical temperature is lower for a harder substrate than for a softer substrate, primarily because of larger interfacial shear stresses. This is supported by the observation on the interfacial shear stress distribution at the bonding interface based on finite element simulation models of substrates with different hardness.…”
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Characterization techniques for power semiconductor and magnetic drives by Tseng, King Jet, Foo, Chek Fok, Tan, Cher Ming

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A study of management control systems in multinational corporations : a Singapore perspective by Ang, Cher Boon, Gan, Siok Hoon, Yip, Pei Wai

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Marketing on internet :case studies on Singapore companies. by Cher, Ming Hui., Chow, Hui Woon., Teo, Cheng Hoon.

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The four mini dragons by Ding, See Yue, Leo, Cher Ling, Seah, Boon Hock

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The impact of information technology on banking services in Singapore by Ang, Cher Hao, Quah, Kwee Seng, Teo, Shann Wei

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The influence of flexible working arrangements on employee turnover intention by Bhasin Yuvraj Vijay, Yang, Cher Ming, Chan, Ngok Chuin

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Supercreative : unleashing creative potential. by Chee, Edison.

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Textile industry in Singapore : the relationship between fringe benefits and industry performance by How Wen-Li Lorraine, Lim Sheau Huei, Tan Cher Ting

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The rotator cuff tendons of the shoulder joint : anatomy and development of a model to predict and prevent tears by Khong, Chee Houe

“…The simulation results showed that the maximum von-Mises stress occurs at the inferior end of the supraspinatus tendon, and the maximum shear strain occurs at the superior end of supraspinatus tendon. …”
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Design and development of domestic health enhancement device for high heel wearers by Chee, Pei Fen

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