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  1. 181

    Evaluation of process requirements for room temperature direct copper bonding by Chen, Qiang.

    Published 2009
    “…In this thesis, by coating the copper surface with a self assembled monolayer of alkanethiol prior to bonding, Cu joints can be successfully formed at room temperature in ambient environment, yielding joint shear strength up to 60MPa. Copper bond shear strength of 15 MPa is achieved even at 50MPa at 25°C with copper coated with C18. …”
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    Final Year Project (FYP)
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