Exploring the Mechanical Behavior of a Traditional Japanese Joint for Flexible Structural Design by Ortea Varela, Ines

“…Subsequently, all iterations were fabricated through 3D printing using PLA and subjected to three-point bending testing. …”
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Fabrication of artificial defects using 3D printing for non-destructive testing applications to determine the location size and shape of defects by Muhammad Azman Subehi

“…One specimen will be made out of Aluminium Silicate (AlSi) and the other specimen will be made out of PolyLactic Acid (PLA). Both specimens will be fabricated with defects inside them. …”
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Identifying new process parameters for preparing poly-caprolactone powder with a solution spraying technique by Phattanaphibul, Thittikorn, Sanguanphak, Haruthai

“…A simple solution spraying technique successfully used for preparing poly-lactic acid (PLA) powder, was applied for PCL. Initial investigations suggested revisiting its process parameters. …”
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Design and investigation of block copolymers for dispersion of carbon nanotubes in polymer matrices by Liu, Chengyin

“…To further improve the tensile properties of the SWNTs/epoxy nanocomposites, we fabricated another series of PI-derived block copolymers via ring-opening polymerization initiated from hydroxyl-terminated polyimide of lactide and allyl-bearing 2-methyl-2-(allyloxycarbonyl)propylene carbonate) (MAC) to produce PLA-b-PI-b-PLA (TB1) and PMAC-b-PI-b-PMAC (TB2) which are polyester and poly(ester-carbonate)-derived, respectively. …”
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Lead-free PCB assembly and effect of solder joint profile on the reliability of PCB assembly by Periannan Arulvanan.

“…PCBs were designed and fabricated with daisy chain loops connected to land pads of daisy chained Ball Grid Array (BGA) components with pad dimensions of 0.56 and 0.66mm NiAu finish. …”
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Process development for flip chip BGA packages by Camenforte, Raymundo M.

“…As the trend towards high performance electronic packaging continues, the introduction of a flip chip ball grid array (FC-BGA) package becomes more attractive to the electronic industry, due to its high packaging density, thermal and electrical performance. …”
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Uncovering wear mechanism of a Fe2Ni2CrAl multi-principal elements alloy by Qiao, Ling, Ramanujan, Raju V., Zhu, Jingchuan

“…By performing reciprocating ball-on-flat friction tests, the Fe2Ni2CrAl MPEA shows good wear resistance, with a wear rate of 8.72 × 10−5 mm3/(Nm) and average friction coefficient of ~ 0.54. …”
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Synthesis of epoxidized poly(ester carbonate)-b-polyimide-b-poly(ester carbonate) : reactive single-walled carbon nanotube dispersants enable synergistic reinforcement around multi... by Liu, Bo, Liu, Chengyin, De Luca, Hugo G., Raman Pillai, Suresh Kumar, Anthony, David B., Li, Jianghua, Bismarck, Alexander, Shaffer, Milo S. P., Chan-Park, Mary Bee Eng

“…Herein, PI-derived block copolymers are synthesized via ring-opening copolymerization of lactide (LA) (a control monomer) and allyl-bearing 2-methyl-2-(allyloxycarbonyl)-propylene carbonate (MAC) from the OH-terminal ends of the PI block to produce PLA-PI-PLA (TB1, a control) and PMAC-PI-PMAC (TB2). …”
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Design and development of stabilized control systems for space application by Chia, Jie Xiang

“…Also, since it is a quick and inexpensive means of fabrication, and weight is a factor of consideration in a HAB, thus the material used for the structure and mounts will be Polylactic Acid (PLA), a commonly used plastic filament in 3D printing. …”
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3D printing of morphing composites by Lim, Shi En

“…Fused Deposition Method (FDM) printing was used in this report. Polylactic Acid (PLA) was the filament used for printing of all the samples. …”
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11 September and China : opportunities, challenges, and warfighting by Li, Nan.

“…All these lessons have been integrated in the two major PLA warfighting scenarios: "superior fighting inferior," and "inferior fight superior."…”
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Tribological properties of Cr- and Ti-doped MoS2 composite coatings under different humidity atmosphere by Ding, Xing-zhao., Zeng, X. T., He, X. Y., Chen, Z.

“…The tribological properties of the coatings were evaluated against an alumina ball under different relative humidity atmosphere using a ball-on-disc tribometer. …”
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Asymptotic improvement of GV bound by Yip, Jose Zheng Ho

“…We also show that for the RLL(0,1) constrained system, we can achieve rates $2\log \phi - \log \tau$, where $\tau$ is the asymptotic of the total ball size for the RLL(0,1) constrained system…”
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The Singapore brand by Ju, Xinhang, Loh, Elicia Qi Yu, Goh, Mavis Pei Jie, Xin, Karen Qian Hui

“…Now, as Singapore moves towards the new era, it realises that it is has entered a different ball game. The fight now is for global creative talent who are believed to be able to give the economy an edge over others. …”
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Processing-properties relationship of nanostructured Ni-Fe-Mo magnetic materials by Shen, Yanping

“…The results showed that even after 100 h of high energy ball milling, the only detected phase was FeNi3. …”
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Efficacy of five insecticides against bagworm, Metisa plana Walker and their side effects on oil palm pollinator, Elaeidobius kamerunicus Faust by Syed Mohamed, Syed Mazuan

“…A ground study was conducted in FELDA Gunung Besout 04, Perak, with its main focus on mistblower application towards M. plana, and its side effects on Elaeidobius kamerunicus. …”
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Implementation of dampers to reduce fatigue loading in 3D lattice structures by Chan, Zi Shan

“…An experiment is conducted on the damper materials using a 90mm by 90mm by 30mm PLA structure to determine the frequencies of damped and undamped, before using the Transmissibility equation to find the lowest ratio. …”
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Fabrication and characterization of graphene and carbon nanotube reinforced bioceramic nanocomposites by Hu, Huanlong

“…Regarding mixing methods, all the ultrasonication mixed and ball milled 1 wt% rGO reinforced HA composites were almost fully densified. …”
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Package and board level reliability modeling of advanced CSP pakages for telecommunication applications by Tee, Tong Yan

“…These technology requirements are possible with the recent development of advanced Chip Scale Packages (CSPs), such as thin-profile fine-pitch Ball Grid Array (TFBGA), Quad-Flat-No-lead (QFN), and wafer-level CSP (WL-CSP). …”
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Game design and control using EEG signals by Zhang, Yanxiang

“…In this project, existing BCI algorithms are reviewed and tested using a consumer-grade headset Muse, and a 2.5D pixel styled action game “8 ball monsters” is developed with an optimised EEG module to obtain user’s concentration through Muse. …”
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