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641
Computer vision approaches for automatic inspection of wire bonding of semiconductor devices
Published 2009“…There is a demand in the semiconductor industries for geometry inspection of the wire bonding balls on an integrated circuit. This is currently being carried out manually by human operator with the aid of a 500X magnification microscope. …”
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642
Tiny Pointers
Published 2024“…Our tiny-pointer constructions also require us to revisit several classic problems having to do with balls and bins; these results may be of independent interest. …”
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