Microstructured BN composites with internally designed high thermal conductivity paths for 3D electronic packaging by He, Hongying, Peng, Weixiang, Liu, Junbo, Chan, Xin Ying, Liu, Shike, Lu, Li, Le Ferrand, Hortense

“…Uniquely, we demonstrate our approach with proof-of-concept composites having locally graded orientations of BN microplatelets to direct the heat away from two vertically stacked heat sources. …”
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