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    Microstructured BN composites with internally designed high thermal conductivity paths for 3D electronic packaging

    Microstructured BN composites with internally designed high thermal conductivity paths for 3D electronic packaging by He, Hongying, Peng, Weixiang, Liu, Junbo, Chan, Xin Ying, Liu, Shike, Lu, Li, Le Ferrand, Hortense

    Published 2022
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    Journal Article

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