Oxidation of a P-C Bond under Mild Conditions by Ilić, Gordana, Gaguly, Rakesh, Petković, Milena, Vidović, Dragoslav

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Metacognitive bias resulting from trade-off between local and global motion signals by Lee, Alan L. F., Yabuki, Hana, Lee, Isaac C. L., Or, Charles C.-F.

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A New Variational Method for Bias Correction and Its Applications to Rodent Brain Extraction by Chang, Huibin, Huang, Weimin, Wu, Chunlin, Huang, Su, Guan, Cuntai, Sekar, Sakthivel, Bhakoo, Kishore Kumar, Duan, Yuping

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Hydrogen-bond memory and water-skin supersolidity resolving the Mpemba paradox by Zhang, Xi, Huang, Yongli, Ma, Zengsheng, Zhou, Yichun, Zhou, Ji, Zheng, Weitao, Jiang, Qing, Sun, Changqing

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Analysis and design recommendations for structures strengthened by prestressed bonded Fe-SMA by Li, Lingzhen, Wang, Sizhe, Chatzi, Eleni, Motavalli, Masoud, Ghafoori, Elyas

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Rapid defect detections of bonded wafer using near infrared polariscope by Asundi, Anand Krishna, Ng, Chi Seng

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Tropical Pacific SST and ITCZ biases in climate models : double trouble for future rainfall projections? by Samanta, Dhrubajyoti, Karnauskas, Kristopher B., Goodkin, Nathalie F.

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Molecular dynamics and simulations study on the vibrational and electronic solvatochromism of benzophenone by Kumar, Venkatraman Ravi, Verma, Chandra, Umapathy, Siva

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Thermal shock resistance enhancement by improved interfacial bonding for carbon/aluminium composites by Wei, Wenfu, Huang, Zhanglin, Yin, Guofeng, Yang, Zefeng, Li, Xiaobo, Zuo, Haozi, Deng, Qin, Huang, Guizao, Ren, Junwen, Liao, Qianhua, Yang, Yan, Wu, Guangning

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Understanding the bonding mechanisms of directly sputtered copper thin film on an alumina substrate by Lim, Ju Dy, Lee, Pui Mun, Chen, Zhong

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Hydrogen bond and surface stress relaxation by aldehydic and formic acidic molecular solvation by Chen, Jiasheng, Yao, Chuang, Zhang, Xi, Sun, Chang Q., Huang, Yongli

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Effect of chain length on low temperature gold-gold bonding by self assembled monolayers by Ang, X. F., Chen, Z., Wong, Chee C., Wei, J.

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Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits by Made, Riko I., Thompson, Carl V., Gan, Chee Lip, Yan, Li Ling, Kor, Katherine Hwee Boon, Chia, Hong Ling, Pey, Kin Leong

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Pyridine N-oxide catalyzed living radical polymerization of methacrylates via halogen bonding catalysis by Xu, Haiyan, Wang, Chen-Gang, Lu, Yunpeng, Goto, Atsushi

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Synthesis of a germylidenide anion from the C-C bond activation of a bis(germylene) by Seow, Celestine, Xi, Hong-Wei, Li, Yongxin, So, Cheuk-Wai

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Oxytocin receptor gene and parental bonding modulate prefrontal responses to cries : a NIRS study by Cataldo, Ilaria, Neoh, Michelle Jin-Yee, Chew, Wei Fang, Foo, Jia Nee, Lepri, Bruno, Esposito, Gianluca

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A three-membered diazo-aluminum heterocycle to access an Al=C π bonding species by Yan, Chenting, Kinjo, Rei

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Recalled parental bonding interacts with oxytocin receptor gene polymorphism in modulating anxiety and avoidance in adult relationships by Cataldo, Ilaria, Bonassi, Andrea, Lepri, Bruno, Foo, Jia Nee, Setoh, Peipei, Esposito, Gianluca

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A highly strained Al-Al σ-bond in dianionic aluminum analog of oxirane for molecule activation by Koshino, Kota, Kinjo, Rei

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Effect of prebonding anneal on the microstructure evolution and Cu–Cu diffusion bonding quality for three-dimensional integration by Peng, L., Zhang, L., Li, H.Y., Lim, Dau Fatt, Tan, Chuan Seng

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