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    Process development for flip chip BGA packages by Camenforte, Raymundo M.

    Published 2008
    “…Some engineers and companies have already done numerous studies and evaluation of different variations of flip chip packaging, its materials, equipment, and improvement of its performance, and published their results and findings. However, few have published information on the methods and the way in which a flip chip BGA package is being developed or processed, especially for high volume production environment.…”
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    Thesis
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