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7361
Improved 3-D frequency-selective structures and their applications
Published 2019“…Using the elliptical loop with stepped-impedance resonator, an 80% reduction in structure thickness is achieved without degrading the performance compared to the original structure, which makes it suitable for practical applications. …”
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Thesis -
7362
Failure analysis and characterization for microelectronic packaging
Published 2017“…Furthermore, as the manufacturing and processing steps of the 3D ICs are significantly different from that of the conventional ICs, new defect and failure mechanisms that are unique to 3D ICs are not well-investigated. …”
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Thesis -
7363
Salient keypoint detectors and compact feature descriptors for 3D perception
Published 2017“…Moreover, with the surge in smartphones equipped with depth sensors such as Lenovo Phab2Pro and Asus Zenfone AR, it is quintessential to develop 3D perception applications that are accurate, and run with low memory, computational and bandwidth requirements. The first two steps of various 3D perception applications, such as Simultaneous Localization and Mapping (SLAM), 3D object recognition, retrieval and 3D reconstruction, are 1. 3D Keypoint Detection - Detect meaningful 3D points of interest that can efficiently represent the input 3D point cloud. 2. 3D Feature Description - Represent the 3D neighbourhood of the detected keypoints with a multi-dimensional vector to determine keypoint correspondences. …”
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Thesis -
7364
A machine-learned approach for reducing airborne delays and environmental impact in terminal manoeuvring area using extended arrival management
Published 2024“…The agents are trained over 1 million steps using the Proximal Policy Optimization (PPO) algorithm and evaluated through 100 simulations against two baseline scenarios: no action and random action. …”
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Thesis-Doctor of Philosophy -
7365
New techniques for searching differential trails in Keccak
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Journal Article -
7366
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7367
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7368
Fabrication and characterization of Algan/Gan high electron mobility transistors on silicon
Published 2016“…Such fabrication method reduces the parasitic inhomogeneities associated with the numerous front-end processing steps and offers more flexibility in device design with limited form factor. …”
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Thesis