3D simulation-based research on the effect of interconnect structures on circuit reliability by He, Feifei, Tan, Cher Ming

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Degradation model of a linear-mode LED driver and its application in lifetime prediction by Lan, Song, Tan, Cher Ming

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Effect of deep cold rolling on residual stress distributions between the treated and untreated regions Ti–6Al–4V alloy by Lim, Andre, Castagne, Sylvie, Chow, Cher Wong

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Temperature and stress distribution in the SOI structure during fabrication by Tan, Cher Ming, Gan, Zhenghao, Gao, Xiaofang

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Comparison of diagnostic performance and inter-reader agreement between PI-RADS v2.1 and PI-RADS v2: systematic review and meta-analysis by Lee, Chau Hung, Vellayappan, Balamurugan, Tan, Cher Heng

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The happiness revolution : live life now. by Hong, Shuqi., Cher, Fiona., Lin, Huanyu., Rusydi, Izzat.

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Characterization techniques for power semiconductor and magnetic drives by Tseng, King Jet, Foo, Chek Fok, Tan, Cher Ming

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A study of management control systems in multinational corporations : a Singapore perspective by Ang, Cher Boon, Gan, Siok Hoon, Yip, Pei Wai

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Marketing on internet :case studies on Singapore companies. by Cher, Ming Hui., Chow, Hui Woon., Teo, Cheng Hoon.

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The four mini dragons by Ding, See Yue, Leo, Cher Ling, Seah, Boon Hock

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The impact of information technology on banking services in Singapore by Ang, Cher Hao, Quah, Kwee Seng, Teo, Shann Wei

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The influence of flexible working arrangements on employee turnover intention by Bhasin Yuvraj Vijay, Yang, Cher Ming, Chan, Ngok Chuin

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Textile industry in Singapore : the relationship between fringe benefits and industry performance by How Wen-Li Lorraine, Lim Sheau Huei, Tan Cher Ting

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Additive manufacturing of multiple materials by selective laser melting : Ti-alloy to stainless steel via a Cu-alloy interlayer by Tey, Cher Fu, Tan, Xipeng, Sing, Swee Leong, Yeong, Wai Yee

“…In this work, the selective laser melting (SLM) process was used to manufacture MM parts which feature steep material transitions from 316L stainless steel (SS) to Ti-6Al-4V (TiA) through an interlayer of HOVADUR® K220 copper–alloy (CuA). …”
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Ab initio simulation of electronic and mechanical properties of aluminium for fatigue early feature investigation by Zhang, Shuai, Tan, Cher Ming, Cheng, Shuguang, Deng, Tianqi, He, Feifei, Su, Haibin

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Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes by Nai, S. M. L., Xu, L. Y., Wei, J., Han, Yongdian, Jing, Hongyang, Tan, Cher Ming

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Investigation of the reliability of nano-nickel/niobium oxide-based multilayer thin films deposited on polymer substrates for flexible electronic applications by Sahay, Rahul, Tu, Yen-Cheng, Aziz, Izzat, Budiman, Arief S., Tan, Cher Ming, Lee, Pooi See, Thomas, Olivier, Raghavan, Nagarajan

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Erasure temperature measurements of heat assisted magnetic recording media by Chen, Y. J., Yang, H. Z., Leong, S. H., Cher, K. M., Hu, J. F., Sethi, P., Lew, Wen Siang

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Fracture toughness assessment of a solder joint using double cantilever beam specimens by Lee, Adeline Puay Chen, Lim, Zan Xuan, Yantara, Natalia, Loo, Shane Zhi Yuan, Tee, Tong Yan, Tan, Cher Ming, Chen, Zhong

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Mapping of sentiment analysis on food security among Malaysians using social media analytics by Rusli, Noradila, Lee, Yoke Lai, Rosley, Muhamad Solehin Fitry, Lee, Cher Enn, Hamzah, Maheran, Alias, Nurul Ezaila, Bahari, Noraini, Mamat, Mohd. Razif

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