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    Additive-free electrophoretic deposition of graphene quantum dots thin films by Nguyen, Tam D., Geuli, Ori, Yeo, Loo Pin, Magdassi, Shlomo, Mandler, Daniel, Tok, Alfred Iing Yoong

    Published 2021
    “…The GQD thin films can be deposited onto ITO with optimal surface morphology at 30 V in 5 min (surface roughness of approximately (3.1±1.3) nm). …”
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    Journal Article
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    Capacitive discharge based transient analysis with fault detection methodology in DC system by Yeap, Yew Ming, Geddada, Nagesh, Ukil, Abhisek

    Published 2020
    “…This paper presents a transient analysis based on DC-link capacitive discharge which can be leveraged to design a fault detection method. …”
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    Journal Article
  5. 605

    Temperature and stress distribution in the SOI structure during fabrication by Tan, Cher Ming, Gan, Zhenghao, Gao, Xiaofang

    Published 2009
    “…Although it is expected that the furnace temperature and withdrawal velocity are the key factors in determining the mechanical stresses, for the present bonding strength of wafers via wafer bonding technology, the withdrawal velocity must be less than 100 mm/min, and under such a withdrawal velocity, the furnace temperature is also an insignificant factor with regard to the induced stress.…”
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    Journal Article
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