High-quality semiconductor fibres via mechanical design by Wang, Zhixun, Wang, Zhe, Li, Dong, Yang, Chunlei, Zhang, Qichong, Chen, Ming, Gao, Huajian, Wei, Lei

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A nano-opto-mechanical pressure sensor via ring resonator by Zhao, X., Tsai, J. M., Cai, H., Ji, X. M., Zhou, J., Bao, M. H., Huang, Y. P., Liu, Ai Qun., Kwong, Dim Lee.

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Hydrogen production via plasma reformers by O'Brien, Christopher J. (Christopher John)

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Leakage current conduction mechanism in 3D capacitor embedded in Through-Silicon Via (TSV) by Lin, Ye, Tan, Chuan Seng

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Design of shoes with adjustable high heel via mobile phone by Wong, Chun Hao

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Engineering Mechanical Counter Pressure Spacesuits and Compression Garments: Active Pressurization and Design for Mobility by Kothakonda, Akshay

“…While there have been several engineering advances in improving the mobility of gas pressure suits, a mechanical counter pressure (MCP) suit seeks to significantly improve mobility and minimize metabolic workload by replacing gas pressure with contact pressure of a tensioned fabric against the body. …”
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Progress in indentation study of materials via both experimental and numerical methods by Zhou, Kun, Koseki, Toshihiko, Liu, Mao, Lin, Jhe-yu, Lu, Cheng, Tieu, Kiet Anh

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Additive manufacturing of cooling responsive shape memory hydrogel via FDM printing by Muhammad Ridhuan Mohamed Hairi

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Microstructure evolution and mechanical property response via 3D printing parameter development of Al–Sc alloy by Kuo, C. N., Chua, Chee Kai, Peng, P. C., Chen, Y. W., Sing, Swee Leong, Huang, Sheng, Su, Y. L.

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Development of a carbon fiber/polyamide 12 composite via selective laser sintering by Oh, Chan Yong

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Development of collagen scaffold with internal channels via indirect rapid prototyping by Yeong, Wai Yee

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Properties optimisation of nanostructures via machine learning: Progress and perspective by Nurul Akmal, Che Lah

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2DEG enhancement via epilayer stress engineering in AlN/GaN/AlN heterostructure by Patwal, Shashank

“…The carrier mobility enhancement in AlN/GaN/AlN heterostructure was achieved via epilayer stress engineering. The high (μ×ns) product reported in this work would lead to higher device output power density.…”
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Mechanistic insights into the membrane fouling mechanism during ultrafiltration of high-concentration proteins via in-situ electrical impedance spectroscopy (EIS) by Tanudjaja, Henry Jonathan, Ng, Angie Qi Qi, Chew, Jia Wei

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Effects of physical stimuli applied via substrate/scaffold on in-vitro culture of mesenchymal stem cells and neurons by Xu, Qinwei

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Personalized robotic control via constrained multi-objective reinforcement learning by He, Xiangkun, Hu, Zhongxu, Yang, Haohan, Lv, Chen

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Enhancing the mechanical strength of Multi Jet Fusion–printed polyamide 12 and its glass fiber-reinforced composite via high-temperature annealing by Liu, Xiaojiang, Tey, Wei Shian, Choo, Jasper Yeng Chee, Chen, Jiayao, Tan, Pengfei, Cai, Chao, Ong, Adrian, Zhao, Lihua, Zhou, Kun

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Tissue engineering small diameter blood vessels : ployurethane formulation with urethane acrylate in micro-patterned scaffold with mechanical analysis by Lee, Zhi Chao.

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Titanium–aluminum–polytetrafluoroethylene coated stainless steel micromold via co-sputtering deposition : replication performance and limitation in hot-embossing by Hardt, David E., Chun, Jung H., Saha, Biswajit, Tor, Shu Beng, Liu, Erjia

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New possibilities in polymer binder jetting additive manufacturing via infiltration and warm isostatic pressing by Park, Seong Jun, Ju, Ho Gi, Park, Seong Je, Hong, Sukjoon, Son, Yong, Ahn, Il Hyuk

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