Integrated circuit packaging, assembly, and interconnections /

Bibliographic Details
Main Author:	223073 Greig, William J.
Format:
Language:	eng
Published:	New York, NY : Springer, 2007
Subjects:	Integrated circuits Microelectronic packaging Interconnects (Integrated circuit technology) Integrated circuits industry
Online Access:	http://dx.doi.org/10.1007/0-387-33913-2

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