Integrated circuit packaging, assembly, and interconnections /
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Format: | |
Language: | eng |
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New York, NY : Springer,
2007
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Online Access: | http://dx.doi.org/10.1007/0-387-33913-2 |
_version_ | 1796670026146643968 |
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author | 223073 Greig, William J. |
author_facet | 223073 Greig, William J. |
author_sort | 223073 Greig, William J. |
collection | OCEAN |
description | 16 |
first_indexed | 2024-03-04T18:39:54Z |
format | |
id | KOHA-OAI-TEST:123775 |
institution | Universiti Teknologi Malaysia - OCEAN |
language | eng |
last_indexed | 2024-03-04T18:39:54Z |
publishDate | 2007 |
publisher | New York, NY : Springer, |
record_format | dspace |
spelling | KOHA-OAI-TEST:1237752020-12-19T17:02:42ZIntegrated circuit packaging, assembly, and interconnections / 223073 Greig, William J. New York, NY : Springer,2007eng16PSZJBLIntegrated circuitsMicroelectronic packagingInterconnects (Integrated circuit technology)Integrated circuits industryhttp://dx.doi.org/10.1007/0-387-33913-2URN:ISBN:0387281533 (hbk.)URN:ISBN:9780387281537 (hbk.) |
spellingShingle | Integrated circuits Microelectronic packaging Interconnects (Integrated circuit technology) Integrated circuits industry 223073 Greig, William J. Integrated circuit packaging, assembly, and interconnections / |
title | Integrated circuit packaging, assembly, and interconnections / |
title_full | Integrated circuit packaging, assembly, and interconnections / |
title_fullStr | Integrated circuit packaging, assembly, and interconnections / |
title_full_unstemmed | Integrated circuit packaging, assembly, and interconnections / |
title_short | Integrated circuit packaging, assembly, and interconnections / |
title_sort | integrated circuit packaging assembly and interconnections |
topic | Integrated circuits Microelectronic packaging Interconnects (Integrated circuit technology) Integrated circuits industry |
url | http://dx.doi.org/10.1007/0-387-33913-2 |
work_keys_str_mv | AT 223073greigwilliamj integratedcircuitpackagingassemblyandinterconnections |