Integrated circuit packaging, assembly, and interconnections /

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Bibliographic Details
Main Author: 223073 Greig, William J.
Format:
Language:eng
Published: New York, NY : Springer, 2007
Subjects:
Online Access:http://dx.doi.org/10.1007/0-387-33913-2
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author 223073 Greig, William J.
author_facet 223073 Greig, William J.
author_sort 223073 Greig, William J.
collection OCEAN
description 16
first_indexed 2024-03-04T18:39:54Z
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institution Universiti Teknologi Malaysia - OCEAN
language eng
last_indexed 2024-03-04T18:39:54Z
publishDate 2007
publisher New York, NY : Springer,
record_format dspace
spelling KOHA-OAI-TEST:1237752020-12-19T17:02:42ZIntegrated circuit packaging, assembly, and interconnections / 223073 Greig, William J. New York, NY : Springer,2007eng16PSZJBLIntegrated circuitsMicroelectronic packagingInterconnects (Integrated circuit technology)Integrated circuits industryhttp://dx.doi.org/10.1007/0-387-33913-2URN:ISBN:0387281533 (hbk.)URN:ISBN:9780387281537 (hbk.)
spellingShingle Integrated circuits
Microelectronic packaging
Interconnects (Integrated circuit technology)
Integrated circuits industry
223073 Greig, William J.
Integrated circuit packaging, assembly, and interconnections /
title Integrated circuit packaging, assembly, and interconnections /
title_full Integrated circuit packaging, assembly, and interconnections /
title_fullStr Integrated circuit packaging, assembly, and interconnections /
title_full_unstemmed Integrated circuit packaging, assembly, and interconnections /
title_short Integrated circuit packaging, assembly, and interconnections /
title_sort integrated circuit packaging assembly and interconnections
topic Integrated circuits
Microelectronic packaging
Interconnects (Integrated circuit technology)
Integrated circuits industry
url http://dx.doi.org/10.1007/0-387-33913-2
work_keys_str_mv AT 223073greigwilliamj integratedcircuitpackagingassemblyandinterconnections