Skip to content
VuFind
English
Deutsch
Español
Français
Italiano
日本語
Nederlands
Português
Português (Brasil)
中文(简体)
中文（繁體）
Türkçe
עברית
Gaeilge
Cymraeg
Ελληνικά
Català
Euskara
Русский
Čeština
Suomi
Svenska
polski
Dansk
slovenščina
اللغة العربية
বাংলা
Galego
Tiếng Việt
Hrvatski
हिंदी
Հայերէն
Українська
Sámegiella
Монгол
Language
All Fields
Title
Author
Subject
Call Number
ISBN/ISSN
Tag
Find
Advanced
Novel diamond grinding wheel f...
Cite this
Text this
Email this
Print
Export Record
Export to RefWorks
Export to EndNoteWeb
Export to EndNote
Permanent link
Novel diamond grinding wheel for fine finishing of IC chip packaging for failure analysis / [nonprojected graphic]
PSZJBL
Bibliographic Details
Format:
Subjects:
Electronic packaging
Holdings
Description
Similar Items
Staff View
Similar Items
Development of binderless diamond grinding wheel for precision machining of the silicon die and the chip packaging on IC chips for failure analysis /
by: 231335 Venkatesh, V. C. (Vellore Chelvaraj), et al.
Published: (2004)
Development of a novel binderless diamond grinding wheel for machining IC chips for failure analysis
by: Venkatesh, V. C., et al.
Published: (2007)
Novel grinding process for failure analysis of IC Chip packaging /
by: 337936 Tang, Kok Fai
Published: (2003)
Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges
by: Ming-Yi Tsai, et al.
Published: (2021-07-01)
Busana tradisional [nonproject graphic]
Published: (2007)