Interfacial reactions between Sn - Ag - Cu solder and Cu - Ni - Pd and Cu - Ni - Au surface finishes /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007

Bibliographic Details
Main Authors:	323613 Azizah Wahi, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal
Format:
Published:	2007
Subjects:	Integrated circuits Intermetallic compounds

Similar Items