Intermetallic formation during soldering between lead-free solders and immersion silver surface finish /

Project Paper (Sarjana Muda Kejuruteraan ((Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2007

Bibliographic Details
Main Authors:	Ch'ng, Emily Huey Ling, 1984-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal
Format:
Language:	eng
Published:	2007
Subjects:	Solder and soldering Integrated circuits

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