Intermetallic formation during soldering between lead-free solders and immersion silver surface finish /

Intermetallic formation during soldering between lead-free solders and immersion silver surface finish /

Project Paper (Sarjana Muda Kejuruteraan ((Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2007

Bibliografiska uppgifter
Huvudupphovsmän: Ch'ng, Emily Huey Ling, 1984-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal
Materialtyp:
Språk:eng
Publicerad: 2007
Ämnen:
Solder and soldering
Integrated circuits

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