Failure assessment of surface mount assembly under thermomechanical loading conditions /

Failure assessment of surface mount assembly under thermomechanical loading conditions /

Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2006

Bibliographic Details
Main Authors: 209274 Liew, Yek Ban, Mohd. Nasir Tamin, supervisor, Universiti Teknologi Malaysia. Fakulti Kejuruteraan Mekanikal
Format:
Language:eng
Published: Skudai : Universiti Teknologi Malaysia, 2006
Subjects:
Electronic packaging

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