Failure assessment of surface mount assembly under thermomechanical loading conditions /

Failure assessment of surface mount assembly under thermomechanical loading conditions /

Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2006

Bibliographic Details
Main Authors:	209274 Liew, Yek Ban, Mohd. Nasir Tamin, supervisor, Universiti Teknologi Malaysia. Fakulti Kejuruteraan Mekanikal
Format:
Language:	eng
Published:	Skudai : Universiti Teknologi Malaysia, 2006
Subjects:	Electronic packaging

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