Area array packaging handbook /

Eitemau Tebyg

• Area array packaging materials : adhesives, pastes, and lead-free /
  gan: Gilleo, Ken
  Cyhoeddwyd: (2004)
• Area array packaging processes : for BGA, Flip Chip, and CSP /
  gan: Gilleo, Ken
  Cyhoeddwyd: (2004)
• MEMS/MOEMS packaging : concepts, designs, metarials, and processes /
  gan: 193092 Gilleo, Ken
  Cyhoeddwyd: (2005)
• Thermal analysis of flip chip ball grid array (FCBGA) electronics package using finite element method /
  gan: Nor Haizully Azizan, 1985-, et al.
  Cyhoeddwyd: (2008)
• Thermal analysis of flip chip ball grid array (FCBGA) electronics package using finite element method [electronic resource] /
  gan: Nor Haizully Azizan, 1985-
  Cyhoeddwyd: (2008)